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5747838-3
| 制造商 | TE Connectivity Ltd. |
| 描述 | Conn D-Subminiature SKT 25 POS 2.75mm Solder RA Thru-Hole 25 Terminal 1 Port D-Sub Standard Connectors DSUB B25S RA590 Standard Board Mount Connectors CONN D-SUB RCPT R/A 25POS GOLD Conn D-Subminiature SKT 25 POS 2.75mm Solder RA Thru-Hole 25 Terminal 1 Port Product Highlights:25 PositionsHousing Gender = ReceptaclePCB Mount Angle = Right AngleProduct Series = HD 20With Mating Connector LockSearch Keywords:Subminiature D, AMPLIMITE, MIL-C-24308, DIN 41652, Mark II, Mark III, DIN 41494, box to box, military/aerospace, 13C3, 3C3, HD-22, ACTION PIN, d-sub, d sub, dsub 25 MSFL RCPT RA 590 (IN,FM,BL) |
| 分类 |
商业参数
| 产品类别 | D-Sub Standard Connectors | 标准包装数量 | Rail / Tube |
| 工厂包装数量 | 10 | ||
合规参数
| RoHS | RoHS Compliant | 无铅定义 | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
| RoHS/ELV合规状态 | RoHS compliant, ELV compliant | 材料阻燃等级 | UL 94V-0 |
电气参数
| 接地方式 | Without | 额定电压 | 125V |
| 连接器阻抗 | 螺纹插针,4-40 UNC, 螺纹插针,4-40 UNC | 最大额定电流 | 6A |
机械参数
| 颜色 | Black | 密封型 | No |
| 外形尺寸(长x宽) | 3 | 镀层 | Tin |
| 材料(通用) | Copper Alloy | 包装方式 | Tube |
| 屏蔽 | 否 | 壳体颜色 | 黑色 |
| 引脚样式 | Round | 外壳尺寸 | 3 |
| 端接方式 | Solder | 触头类型 | Signal |
| 柱间距 | .108 | 外壳表面处理 | 锡 |
| 第二连接器 | With | 触点形状 | Round |
| 安装类型 | Right Angle | 外壳镀层 | Tin |
| 连接器类型 | Receptacle, Female Sockets | 接触镀层 | Gold |
| 法兰特征 | Housing/Shell (4-40) | 接地类型 | With |
| 尖端材料(笔尖) | Tin | 安装样式 | Through Hole |
| 排数 | 2 | 壳体镀层 | 锡 |
| 外壳材料(壳体) | Steel | 电路板厚度 | 0.062 [1.57] |
| 连接器样式 | D-Sub | 插入件材料 | Zinc |
| 锁定特性 | Threaded Inserts | 磁芯材质 | 黄铜 |
| 材料表面处理 | Clear Chromate | 外形(宽 x 高) | Standard |
| 触头材料 | Phosphor Bronze | 壳体材料 | Thermoplastic |
| 安装特性 | 板锁 | 包装数量 | 10 |
| 面板安装类型 | Without | 尺寸/外形 | 0.66 [.026] |
| 接地凹痕 | Without | 外形尺寸 长x宽x高 | 14.99 [.590] |
| 端接样式 | Through Hole | 连接器颜色 | None |
| 外径 | .66 mm [ .026 in ] | 触点数 | 25 |
| 位数 | 25 | 外壳尺寸-插件 | Front Metal Shell |
| 安装孔直径 | 3.18 [.125] | 外壳材料及表面处理 | Steel, Tin Plated |
| 端子柱长度 | 3.18 [0.125] | 接触镀层厚度 | Flash |
| 触点材料 - 镀层 | 锌 | 外壳与棱镜材料 | 否 |
| 后壳材料及镀层 | 锡 | 外壳尺寸,连接器布局 | 3 (DB, B) |
产品信息
| 备注 | All receptacles are preloaded with size 20 DF posted socket contacts | 连接器性别 | Female |
| 系列 | HD-20 | 产品特性 | Board Lock, Ground Strap |
| 可密封 | 否 | 制造商全称 | AMP |
| 预装 | 是 | 产品子类型 | 连接器 |
| 其他规格 | 否 | ||
环境参数
| 工作温度 | -55°C ~ 105°C | 封装热阻 | 1.57 mm [ .062 in ] |
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