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0447641803
| 制造商 | Molex, LLC |
| 描述 | Conn Wire to Board RCP 18 POS 3mm Solder RA Thru-Hole Tray MICROFIT (3.0) BMI RA HDR/FEM |
| 分类 |
商业参数
| 标准包装数量 | Trays | ||
合规参数
| RoHS | Lead free / RoHS Compliant | 欧盟RoHS | Compliant |
电气参数
| 最大额定电流 | 5/Contact | 最小输入电压 | 250V |
机械参数
| 颜色 | Black | 间距 | 3 mm |
| 包装方式 | Tray | 排间距 | 0.118" (3.00mm) |
| 端接方式 | Solder | 触头类型 | Female Socket |
| 安装类型 | Through Hole | 连接器类型 | Receptacle |
| 接触镀层 | Gold | 排数 | 2 |
| 触头材料 | Phosphor Bronze | 触点数 | 18 |
| 位数 | 18 | 接触镀层厚度 | 30µin (0.76µm) |
产品信息
| 类型 | Wire to Board | 连接器性别 | RCP |
| 产品特性 | Board Guide | 加载位置数 | All |
文档与媒体
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