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5-104550-3
| 制造商 | TE Connectivity Ltd. |
| 描述 | Conn Socket Strip RCP 24 POS 1.27mm Solder ST SMD Tube .050 X .100 AMPMODU System 50 CONN RECEPT 24POS .050 DUAL SMD Board to Board & Mezzanine Connectors 24 SYS50 SURFMNT DRST RCPT SN .050 X .100 AMPMODU System 50 Product Highlights:Receptacle AssemblyNumber of Positions = 24Number of Rows = DualVertical Mount AnglePCB Mount Style = Surface MountSearch Keywords:wire to wire, wire to board, IDC, latching, high density, co-planar, horizontal, pcb connectors, AMPMODU 24 SYS50 SURFMNT DRST RCPT SN |
| 分类 |
商业参数
| 商标名 | AMPMODU | 标准包装规格 | 23 |
| 产品类别 | Board to Board & Mezzanine Connectors | 标准包装数量 | Rail / Tube |
合规参数
| RoHS | Lead free / RoHS Compliant | 标准 | CSA LR7189, UL E28476 |
| 无铅定义 | Reflow solder capable to 245°C, Reflow solder capable to 260°C | RoHS/ELV合规状态 | RoHS compliant, ELV compliant |
| 材料阻燃等级 | UL 94V-0 | ||
电气参数
| 额定电压 | 30 V | 供电电压 | 30 |
| 输入电阻 | 5000 | 额定交流电压 | 30 |
| 击穿电压 | 500 | 绝缘电阻 | 5,000 |
机械参数
| 颜色 | Black | 间距 | 1.27 mm |
| 高度 | 9.398 mm [ .37 in ] | 镀层 | Tin |
| 包装方式 | Tube | 壳体颜色 | 黑色 |
| 轴径尺寸 | 不带 | 排间距 | 0.100" (2.54mm) |
| 端接方式 | Solder | 外壳颜色 | Black |
| 安装类型 | Vertical | 连接器类型 | Receptacle |
| 接触镀层 | Gold Over Nickel | 安装样式 | Surface Mount |
| 排数 | 2 | 电路板厚度 | 1.57 |
| 插入件材料 | 磷青铜 | 触头材料 | Phosphor Bronze |
| 壳体材料 | Thermoplastic Glass Reinforced | 刀片材料 | Copper Alloy |
| 安装特性 | 压具柱体 | 包装数量 | Tube |
| 面板安装类型 | 表面贴装 | 连接器间距 | .1 |
| 端接样式 | SMD | 板面高度 | 0.370" (9.40mm) |
| 触点数 | 24 | 位数 | 24 |
| 兼容外壳尺寸（如TM-700等） | 插头组件 | 表面贴装焊盘尺寸 | Without |
| 夹持材料 - 镀层 | Tin | 接触镀层厚度 | 30µin (0.76µm) |
| 堆叠高度（配合） | 0.470", 0.515" (11.94mm, 13.08mm) | ||
产品信息
| 类型 | Socket Strip | 连接器性别 | RCP |
| 系列 | AMPMODU SYSTEM 50 | 产品特性 | Board Lock |
| 可堆叠 | No | 制造商全称 | AMP |
| 产品子类型 | Receptacle Assembly | 装配配置 | Board Standoff |
| 加载位置数 | All | ||
环境参数
| 温度范围 | -65 â +105 | 工作温度 | -65 – 105 |
文档与媒体
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