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147323-4
| 制造商 | TE Connectivity Ltd. |
| 描述 | Conn Shrouded Header HDR 5 POS 2.54mm Solder RA SMD T/R .100 AMPMODU Headers, Housings & Contacts CONN HEADER 5POS SL R/A SMD AU Headers & Wire Housings 05 MTE HDR SRRA SMT.100CL .100 AMPMODU Headers, Housings & Contacts Product Highlights:HeaderNumber of Positions = 5Number of Rows = SinglePost Size = 0.64 [.025] mm [in]Terminate To Printed Circuit BoardSearch Keywords:AMPMODU, NIC, Network Interface Cards, PC Cards, wire to board, wire to wire, TS 100 System, discrete wire, IEC 603-8, smt, signal, pcb connectors, MTE, MTE Header;5;3A;600V;MTE(IDC);1;RightAngle;0.100in.;5000Megohms 05 MTE HDR SRRA SMT.100CL |
| 分类 |
商业参数
| 商标名 | AMPMODU | 其他名称 | A110983CT |
| 标准包装规格 | 300 | 产品类别 | Headers & Wire Housings |
| 标准包装数量 | Tape & Reel | ||
合规参数
| RoHS | Contains lead / RoHS non-compliant | 标准 | ULListed,CSACertified |
| 认证机构 | CSA,UL | 标准编号 | CSA LR7189, UL E28476 |
| 材料阻燃等级 | UL 94 V-0 | ||
电气参数
| 开关功能 | Latched | 接触电阻 | 15 mΩ |
| 连接器阻抗 | 刺破式压接 (IDC), 压接 | 最大额定电流 | 3 A |
| 绝缘电阻 | 5000 MOhms | 直流开关电压 | 600V |
| 保护额定电压（VPR） | 600 V | ||
机械参数
| 颜色 | Black | 间距 | 2.54 mm |
| 高度 | 13.59 mm [ .535 in ] | 长度 | 17.78 mm [ .7 in ] |
| 包装方式 | Tape & Reel (TR) | 壳体颜色 | 黑色 |
| 引脚样式 | 正方形 | 排间距 | 2.54 mm |
| 端接方式 | Solder | 触头类型 | Male Pin |
| 安装类型 | Surface Mount, Right Angle | 行程角度 | Right |
| 连接器类型 | Header, Shrouded | 接触镀层 | Gold Over Nickel |
| 触点时序 | Without | 安装样式 | 带有 |
| 排数 | 1 | 插入件材料 | 黄铜 |
| 触头材料 | Brass | 壳体材料 | Thermoplastic |
| 总长度 | 0.7" | 包装数量 | 300 |
| 面板安装类型 | 不带 | 主要材料 | InterconnectSystem |
| 插针孔直径 | 0.1" | 端接样式 | SMD |
| 第一连接器类型 | 带罩 | 第一触头极性 | Pin (Male) |
| 触点数 | 5 | 接触件尾部长度 | 2.54 – 5.08 µm [ 100 – 200 µin ] |
| 绝缘直径 | 0.054" | 位数 | 5 |
| 兼容外壳尺寸（如TM-700等） | 母端护套组件 | 触头长度-柱 | 3.05 mm [ .12 in ] |
| 触点镀层 | Gold(30) | 安装孔直径 | 0.047" |
| 接触件表面处理 - 配合 | 锡铅 | 接触长度 - 配合 | 0.230" (5.84mm) |
| 端子柱长度 | 5.84 mm [ .23 in ] | 接触镀层厚度 | 30µin (0.76µm) |
| 静电放电屏蔽 | 不带 | ||
产品信息
| 备注 | 使用 91417-1 号键控工具来拆卸用于键控的柱体。 | 类型 | Shrouded Header |
| 连接器性别 | HDR | 系列 | AMPMODU MTE |
| 产品特性 | Board Lock, Solder Retention | 制造商全称 | AMPMODU/MTESeries |
| 架构类型 | 否 | 产品子类型 | Headers |
| 矩阵（列×行） | 0.100in. | 加载位置数 | All |
环境参数
| 测试温度 | 高 | 工作温度 | - 65 C to + 105 C |
文档与媒体
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