The Bergquist Company
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嵌入式系统与开发工具(1)
产品系列共 21 个系列
更多 →Self-adhesive thermal interface pads for electronic heat dissipation
Thin polypropylene thermal pads for heat management in electronics
Adhesive thermal pads for power module heat management
Dual cartridge liquid gap fillers for thermal conductivity applications
Thermal gap pads for heat management, 0.8W/m·K, 8x16 inches, 0.040 inch thickness
Thermal gap pads for heatsink insulation and heat management
Thin thermal interface sheets for heat management applications
High-performance thermal interface pads for heat management
Versatile thermal pads for efficient heat management in electronics
Thermal gap pads for heat dissipation in electronic devices
Soft thermal interface pads for heat management in various thicknesses
High-flow adhesive heat pads for various electronic package types
High-performance thermal interface materials for heat management
High-performance thermal gap pads for efficient heat management
Flexible thermal gap pads for heat management in electronics
High-flow adhesive thermal pads for various electronic package types
High-flow thermal gap pads with adhesive for heat management
High-performance thermal gap pads for efficient heat transfer
Thin silicone thermal pads for heat dissipation in electronics
Thermal interface pads for heat management in electronics