CL02JT10N |
stackpole |
Ind Chip Multi-Layer 10nH 5% 100MHz 8Q-Factor 300mA 0402 Paper T/R |
CL02JT12N |
stackpole |
Ind Chip Multi-Layer 12nH 5% 100MHz 8Q-Factor 300mA 0402 Paper T/R |
CL02JT15N |
stackpole |
Ind Chip Multi-Layer 15nH 5% 100MHz 8Q-Factor 300mA 0402 Paper T/R |
CL02JT18N |
stackpole |
Ind Chip Multi-Layer 18nH 5% 100MHz 8Q-Factor 300mA 0402 Paper T/R |
CL02JT22N |
stackpole |
Ind Chip Multi-Layer 22nH 5% 100MHz 8Q-Factor 300mA 0402 Paper T/R |
CL02JT27N |
stackpole |
Ind Chip Multi-Layer 27nH 5% 100MHz 8Q-Factor 300mA 0402 Paper T/R |
CL02JT33N |
stackpole |
Ind Chip Multi-Layer 33nH 5% 100MHz 8Q-Factor 200mA 0402 Paper T/R |
CL02JT39N |
stackpole |
Ind Chip Multi-Layer 39nH 5% 100MHz 8Q-Factor 150mA 0402 Paper T/R |
CL02JT47N |
stackpole |
Ind Chip Multi-Layer 47nH 5% 100MHz 8Q-Factor 150mA 0402 Paper T/R |
CL02JT68N |
stackpole |
Ind Chip Multi-Layer 68nH 5% 100MHz 8Q-Factor 100mA 0402 Paper T/R |
CL02JT82N |
stackpole |
Ind Chip Multi-Layer 82nH 5% 100MHz 8Q-Factor 100mA 0402 Paper T/R |
CL02JTR10 |
stackpole |
Ind Chip Multi-Layer 100nH 5% 100MHz 8Q-Factor 100mA 0402 Paper T/R |
CL02JTR12 |
stackpole |
MULTILAYER CHIP INDUCTOR |
CL02A102KQ2NNNC |
samsung electro-mechanics |
Cap Ceramic 0.001uF 6.3V X5R 10% SMD 01005 85°C Cardboard T/R |
CL02A103KQ2NNNC |
samsung electro-mechanics |
Cap Ceramic 0.01uF 6.3V X5R 10% SMD 01005 85°C Cardboard T/R |
CL02A103KQ2NNNE |
samsung electro-mechanics |
Cap Ceramic 0.01uF 6.3V X5R 10% SMD 01005 85°C Embossed T/R |
CL02A104KQ2NNNC |
samsung electro-mechanics |
Cap Ceramic 0.1uF 6.3V X5R 10% SMD 01005 85°C Cardboard T/R |
CL02A104KR2NNNC |
samsung electro-mechanics |
Cap Ceramic 0.1uF 4V X5R 10% SMD 01005 85°C Paper T/R |
CL02A104MR2NNNC |
samsung electro-mechanics |
Cap Ceramic 0.1uF 4V X5R 20% SMD 01005 85°C Cardboard T/R |
CL02A104MR2NNNE |
samsung electro-mechanics |
CAP,0.1UF,4V,20%,SMD,01005 |