图片仅供参考,产品以实物为准
| 规格书 |
 583294-2 AMP LEAF SOLDER DIP CONTACT FOR 052 DIAHOLE POWER_CONNECTORS_CATALOG_SEC02_CABLE_MOUNTED Connector, AMP-LEAF, 000030 Gold Plated Contacts, DPH Housing Connector, AMP-LEAF, 000030 Gold Plated Contacts, DPH Housing Connector, AMP-LEAF, Phenolic or Thermoplastic Housing Connector, AMP-LEAF, Phenolic or Thermoplastic Housing Connector, AMP-LEAF, Tin Plated Contact Connector, AMP-LEAF, Tin Plated Contact AMP-LEAF SERIES CONNECTOR REPORT AMPLEAF |
| Rohs | Contains lead / RoHS non-compliant |
| 标准包装 | 5,000 |
| 引脚或插口 | Non-Gendered |
| 线规 | - |
| 接触终止 | Solder |
| 触点表面涂层 | Gold |
| 触点涂层厚度 | 15µin (0.38µm) |
| 包装材料 | Bulk |
| 连接器类型 | Connector Power |
| 触点电镀 | Gold Over Nickel |
| 性别 | SKT |
| 端接方式 | Solder |
| 标准包装 | Bulk |
| 联系方式包装方式 | Loose Piece |
| PCB厚度（毫米） | 1.57 [0.062] |
| Lead Free Solder Processes | Not relevant for lead free process |
| 要终止 | Printed Circuit Board |
| 端子尾部电镀 | Tin |
| 联系侵 | Nickel (50) |
| 接线方式 | Solder Dip |
| RoHSELV合规性 | Not ELV/RoHS compliant |
| 触点区域镀层材料 | Gold (15) |
| 产品类型 | Solder Eyelet Contact |
| 触点材料 | Phosphor Bronze |
| 触点表面涂层 | Gold |
| 封装 | Bulk |
| 针脚或插座 | Non-Gendered |
| Contact Finish Thickness | 15µin (0.38µm) |
| 接触端子 | Solder |
| RoHS指令 | Contains lead / RoHS non-compliant |
| RoHS | No RoHS Version Available |
| 标准包装 | 5,000 |
| 端子接触部电镀厚度 (µin) | 15 |
| 下地の材料 | 镍 |
| 端子类型 | 公端 |
| 封装数量 | 5000 |
| 端子接触部电镀材料 | 金 |
| 封装方法 | 活块 |
| PCB 厚度（建议） | .062 in, 1.57 mm |
| 端子基材 | 磷青铜 |
| 焊尾端子电镀材料 | 锡 |
| 连接器和端子端接到 | 印刷电路板 |
| 产品类型 | 接触件 |
| 线缆端接方法 | 浸焊 |
| usewith | 583726-1 583725-1 583617-1 343887-1 583552-1 583722-1 More> |
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