规格书 |


|
类型 |
Backplane |
间距 |
2.54 mm |
触点数 |
180 |
端接方式 |
Solder |
安装 |
Through Hole |
触点电镀 |
Gold Over Palladium Nickel |
标准包装 |
Bulk |
RoHSELV合规性 |
RoHS compliant, ELV compliant |
Lead Free Solder Processes |
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
插座PowerGround材料 |
Phosphor Bronze |
交配型 |
Receptacle |
端子尾部电镀 |
Tin over Nickel |
品牌 |
AMP |
补强板材质 |
Aluminum |
外壳材料 |
Liquid Crystal Polymer (LCP) |
PCB安装角度 |
Right Angle |
引线长度(毫米( ) ) |
4.19 [0.165] |
外壳颜色 |
Black |
PCB保持力特性 |
No |
触点区域镀层材料 |
Gold Flash over Palladium Nickel |
产品类型 |
Connector |
RoHSELV符合记录 |
Always was RoHS compliant |
位置数 |
180 |
信号插座材料 |
Phosphor Bronze |