规格书 |
|
类型 |
Backplane |
间距 |
2 mm |
行数 |
4 |
触点数 |
72 |
端接方式 |
Press Fit |
安装 |
Through Hole |
触点电镀 |
Gold Over Palladium Nickel |
标准包装 |
Bulk |
RoHSELV合规性 |
RoHS compliant, ELV compliant |
触点材料 |
Phosphor Bronze |
Lead Free Solder Processes |
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
终止(焊接)长度(mm (英寸) ) |
2.73 [0.107] |
PCB安装角度 |
Right Angle |
模块类型 |
Signal |
中心线矩阵(毫米) |
2.00 x 2.00 [.079 x .079] |
脚头宽度(毫米( ) ) |
16.00 [0.622] |
外壳材料 |
Liquid Crystal Polymer (LCP) |
信号位置数 |
72 |
配合柱长度(毫米( ) ) |
5.00 [0.197] |
触点区域镀层材料 |
Gold Flash over Palladium Nickel |
发表电镀 |
Tin |
排序 |
No |
产品类型 |
Free-Board (Header) |
RoHSELV符合记录 |
Always was RoHS compliant |
额定电压(VAC ) |
30 |
发表类型 |
Solder Post |