规格书 |
|
Status |
Active |
类型 |
1.0/2.3 |
性别 |
RCP |
阻抗 |
50 Ohm |
端接方式 |
Solder |
安装 |
Through Hole |
身体上的取向 |
Straight |
触点材料 |
Beryllium Copper |
触点电镀 |
Gold |
家庭 |
1393670 |
要终止 |
PCB |
标准包装 |
Trays |
评论 |
For assembly instructions, see General Information Section. |
RoHSELV合规性 |
RoHS compliant, ELV compliant |
Lead Free Solder Processes |
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
品牌 |
AMP |
面板附件 |
With |
包装数量 |
100 |
连接器阻抗( Ω ) |
50 |
端接类型 |
Printed Circuit Board |
面板固定方法 |
Bulkhead |
产品类型 |
Connector |
RoHSELV符合记录 |
Always was RoHS compliant |
耦合器类型 |
A (Screw), C (Slide-In), F (Latching/Quick Lock) |