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44428-1001
| 制造商 | Molex, LLC |
| 描述 | CONN HEADER 10POS 3MM RT ANG TIN Molex 44428 Series 3mm Pitch 10 Way 2 Row Right Angle PCB Header, Solder Termination, 5A Headers & Wire Housings R.A. RECPT 10P tin w/snap-in pegs 3.00mm Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 10 ... 3.00mm Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 10 Circuits, Tin (Sn) Plating Conn Wire to Board HDR 10 POS 3mm Solder RA Thru-Hole Tray Molex Micro-Fit BMI 系列 3mm节距 10路 (2排) 直角 PCB 针座, 焊接端接, 5A , 通孔 |
| 分类 |
商业参数
| 商标名 | Micro-Fit 3.0 | 零件号别名 | 0444281001 |
| 产品类别 | Headers & Wire Housings | 标准包装数量 | 1 |
| 工厂包装数量 | 588 | ||
合规参数
| RoHS | Compliant | ||
电气参数
| 额定电压 | 250 V | 最大额定电流 | 5A |
机械参数
| 颜色 | Black | 间距 | 0.118" (3.00mm) |
| 包装方式 | Tray | 方向 | 直角 |
| 排间距 | 0.118" (3.00mm) | 端接方式 | Solder |
| 触头类型 | Male Pin | 安装类型 | Through Hole, Right Angle |
| 连接器类型 | Header, Shrouded | 接触镀层 | Tin |
| 排数 | 2 | 触头材料 | Brass Alloy |
| 壳体材料 | Thermoplastic | 端接排数 | 焊接 |
| 端接样式 | Through Hole | 触点数 | 10 |
| 位数 | 10 | 接触镀层厚度 | 200µin (5.08µm) |
产品信息
| 类型 | Wire to Board | 系列 | 44428 |
| 覆盖范围 | 覆盖 | 产品特性 | Board Lock |
| CAD图纸 | 3D CAD Model | 产品子类型 | Header Assemblies |
| 基础产品编号 | 44428 | 加载位置数 | All |
文档与媒体
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