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DSPIC33EP512MU810-I/BG
| 制造商 | Microchip Technology Inc. |
| 描述 | . DSPIC33EP512MU810-I/BG - dsPIC dsPIC™ 33EP Microcontroller IC 16-Bit 70 MIPs 512KB (170K x 24) FLASH 121-TFBGA (10x10) from Microchip Technology. from now! |
| 分类 |
商业参数
| 最小起订量 | 184 | 产品 | DSCs |
| 单位包装 | 184 | 其他名称 | DSPIC33EP512MU810IBG |
| 标准包装数量 | 184 | ||
合规参数
| RoHS | Lead free / RoHS Compliant | ||
电气参数
| 转速 | 70 MIPs | 定时器 | 4 x 32 bit, 9 x 16 bit |
| 存储器 | 512KBytes | RAM 大小 | 24K x 16 |
| 内核大小 | 16-Bit | 核心类型 | dsPIC |
| 分辨率 | 8.32ns | 存储器类型 | Flash |
| I/O 数量 | 83 | 位数 | 16 |
| 额定电压 | 3 → 3.6 V | 数据转换器 | A/D 32x10b/12b |
| 最大频率 | 70MHz | DAC数量 | 1 |
| 振荡器类型 | Internal | 分辨率(位) | 12/24bit |
| 通道数量 | 0 | 非易失性存储器 | 0Bytes |
| 程序存储器大小 | 512KB (170K x 24) | 程序存储器类型 | FLASH |
| ADC/DAC 数量 | 32 | 频率(中心/带宽) | 16 bit, 32 bit |
| 供电电压 (Vcc/Vdd) | 3 V ~ 3.6 V | ||
机械参数
| 宽度 | 10mm | 高度 | 1.2mm |
| 长度 | 10mm | 包装方式 | Tray |
| 安装类型 | Surface Mount | 封装形式 | 121-TFBGA |
| 冷却的封装 | TFBGA | 尺寸/外形 | 10 x 10 x 1.2mm |
| 位数 | 121 | 供应商器件封装 | 121-TFBGA (10x10) |
| 核心数/总线宽度 | 16bit | 脉冲宽度失真(最大) | 12 (1 x 8.32 ns) |
产品信息
| USB | 1 | 类型 | DSP |
| 系列 | DSPIC33E | 外设 | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT |
| 架构 | C | 连接性 | CAN, I²C, IrDA, LIN, QEI, SPI, UART/USART, USB OTG |
| 制造商全称 | Microchip Technology | 核心处理器 | dsPIC |
| 定时器数量 | 13 | 射频系列/标准 | dsPIC33 |
环境参数
| 工作温度 | -40°C ~ 85°C | ||
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