Vishay / Sfernice
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Unit Pack | 25 |
| MOQ | 25 |
| Maximum Operating Temperature | +125°C |
| Maximum Temperature Coefficient | +150ppm/°C |
| Minimum Operating Temperature | -55°C |
| Minimum Temperature Coefficient | -150ppm/°C |
| Package/Case | Moulded |
| Power Rating | 25W |
| Resistance | 470Ω |
| Technology | Thick Film |
| Temperature Coefficient | ±150ppm/°C |
| Termination Style | Solder Lug |
| Tolerance | ±5% |
| rohs | Compliant |
| Board Level Components | Y |
| 容差 | ±5% |
| 最高工作温度 | +125°C |
| 额定功率 | 25W |
| 技术 | 厚膜 |
| 最低工作温度 | -55°C |
| 温度系数 | ±150ppm/°C |
| 最大温度系数 | +150ppm/°C |
| 电阻值 | 470 Ω |
| 接端样式 | 螺丝 |
| 最小温度系数 | -150ppm/°C |
| 系列 | RCH25 |
| 封装/外壳 | S06 |
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