texas instruments
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Package | 256BGA |
| Operating Temperature | -40 to 85 °C |
| Standard Package | Trays |
| Product Category | RF Wireless Misc |
| RoHS | RoHS Compliant |
| Package / Case | BGA-256 |
| Packaging | Tray |
| Mounting Style | SMD/SMT |
| Factory Pack Quantity | 90 |
| Max. Betriebstemperatur | 85 |
| EU RoHS | Compliant |
| Package Height | 1.52(Max) |
| Stiftanzahl | 256 |
| Standard-Verpackungsname | BGA |
| Befestigung | Surface Mount |
| Min. Betriebstemperatur | -40 |
| Lieferantenverpackung | BGA |
| Leitungsform | Ball |
| Package Width | 17.2(Max) |
| PCB | 256 |
| Package Length | 17.2(Max) |
| Kategorie | Crest Factor Reduction Processor |
| Function | Crest Factor Reduction Processor |
| Supplier Device Package | 256-PBGA (17x17) |
| RF Type | Cellular, CDMA2000, W-CDMA |
| Secondary Attributes | 2 Channels |
| Other Names | 296-20702 |
| Package/Case | 256-BGA |
| rohs | Lead free / RoHS Compliant |
| Series | GC1115 |
| Package Type | BGA |
| Pin Count | 256 |
| Screening Level | Industrial |
| Rad Hardened | No |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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