所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Type | Passive |
| Device Cooled | BGA |
| Thermal Resistance | 2.5 °C/W |
| Attachment Method | Adhesive Tape |
| Product Height | 12.7 mm |
| Product Length | 30 mm |
| Fin Style | Thin |
| Finish | Black Anodized |
| Standard Package | Bulk |
| Product Category | Heat Sinks |
| Product | Heat Sinks |
| Mounting Style | Adhesive |
| Length | 30 mm |
| Width | 30 mm |
| Height | 12.7 mm |
| Designed for | BGA, PGA, PLCC, QFP |
| Color | Black |
| Height Off Base (Height of Fin) | 0.500" (12.70mm) |
| Material | Aluminum |
| Shape | Square |
| Material Finish | Black Anodized |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Thermal Resistance @ Forced Air Flow | 2.5°C/W @ 200 LFM |
| rohs | Lead free / RoHS Compliant |
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