所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Product Category | Heat Sinks |
| Product | Heat Sinks |
| Mounting Style | SMD/SMT |
| Fin Style | Horizontal |
| Thermal Resistance | 3.25 C /W |
| Length | 30 mm |
| Width | 30 mm |
| Height | 9.5 mm |
| Designed for | BGA, PGA, PLCC, QFP |
| Color | Black |
| Height Off Base (Height of Fin) | 0.370" (9.40mm) |
| Material | Aluminum |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Shape | Square |
| Material Finish | Black Anodized |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Standard Package | 100 |
| Thermal Resistance @ Forced Air Flow | 3.3°C/W @ 200 LFM |
| Type | Top Mount |
| rohs | Lead free / RoHS Compliant |
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