te connectivity / amp
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Type | Passive |
| Device Cooled | BGA |
| Product Height | 11.23 mm |
| Fin Style | Radial |
| Finish | Black Anodized |
| Material | Aluminum |
| Standard Package | Bulk |
| RoHS | RoHS Compliant |
| Packaging | Bulk |
| RoHSELV Compliance | RoHS compliant, ELV compliant |
| Lead Free Solder Processes | Not relevant for lead free process |
| Height (mm (in)) | 11.23 [0.442] |
| Diameter (mm (in)) | 34.92 [1.375] |
| Package Size (mm (in)) | 21 [.827] |
| Device Type | BGA |
| Flammability Rating | UL 94V-0 |
| Heat Sink Type | 3 Fin Radial |
| For Use With | BGA Semiconductor Packages |
| Line | ChipCoolers |
| Product Type | Heat Sink |
| RoHSELV Compliance History | Converted to comply with RoHS directive |
| Diameter | 1.375" (34.92mm) OD |
| Height Off Base (Height of Fin) | 0.442" (11.23mm) |
| Thermal Resistance @ Natural | 13.2°C/W |
| Attachment Method | Clip |
| Shape | Cylindrical |
| Material Finish | Black Anodized |
| Package Cooled | BGA |
| Thermal Resistance @ Forced Air Flow | 6.0°C/W @ 200 LFM |
| rohs | Lead free / RoHS Compliant |
| Rad Hardened | No |
| Body Material | Aluminum |
| Product Height (mm) | 11.23 mm |
| Product Diameter (mm) | 34.92 mm |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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