所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Type | Passive |
| Device Cooled | D2 PAK|TO-263 |
| Attachment Method | Surface Mount |
| Product Depth | 19.38 mm |
| Product Height | 11.43 mm |
| Product Length | 25.4 mm |
| Standard Package | Bulk |
| Product Category | Heat Sinks |
| RoHS | RoHS Compliant |
| Product | Heat Sinks |
| Mounting Style | SMD/SMT |
| Heatsink Material | Aluminum |
| Thermal Resistance | 11 C/W |
| Length | 19.38 mm |
| Width | 25.4 mm |
| Height | 11.43 mm |
| Designed for | TO-263, Surface Mount |
| Factory Pack Quantity | 500 |
| Part # Aliases | 042188 |
| Product Length | 25.4 |
| EU RoHS | Compliant |
| Product Depth | 19.38 |
| Product Height | 11.43 |
| Height Off Base (Height of Fin) | 0.450" (11.43mm) |
| Material | Copper |
| Thermal Resistance @ Natural | 11°C/W |
| Shape | Rectangular |
| Material Finish | Tin |
| Package Cooled | D²Pak, PowerSO-10 |
| Thermal Resistance @ Forced Air Flow | 3°C/W @ 300 LFM |
| Power Dissipation @ Temperature Rise | 2W @ 30°C |
| rohs | Lead free / RoHS Compliant |
| Rad Hardened | No |
| Product Length (mm) | 25.4 mm |
| Product Depth (mm) | 19.38 mm |
| Product Height (mm) | 11.43 mm |
| DELETED | Compliant |
| Packages Cooled | :TO-263 |
| External Height - Imperial | :0.43" |
| External Height - Metric | :11mm |
| External Width - Imperial | :0.76" |
| External Width - Metric | :19.38mm |
| External Length - Imperial | :0.98" |
| External Length - Metric | :25mm |
| Heat Sink Material | :Copper |
| SVHC | :No SVHC (20-Jun-2013) |
| Mounting Type | :Surface Mount |
| Weight (kg) | 0.006 |
| Tariff No. | 90261089 |
| Application | ThroughHoleDiscreteSemiconductors |
| Dimensions | 19.38mmLx25.4mmHx11.43mmW,0.763in.Lx1in.Hx0.45in.W |
| Finish | TinPlated |
| PrimaryType | TO-263 |
| SpecialFeatures | SurfaceMountforD?PAK |
| ThermalResistance | 9?C/W |
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