Infineon Technologies AG
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Mounting | Surface Mount |
| Package Width | 4.4 |
| PCB | 28 |
| Maximum Power Dissipation | 810 |
| EU RoHS | Compliant |
| Bridge Type | 3-Phase Bridge|Full Bridge |
| Maximum Fall Time | 45 |
| Peak Output Current | 0.41(Typ) |
| Minimum Operating Temperature | -40 |
| Driver Configuration | Inverting|Non-Inverting |
| Driver Type | High and Low Side |
| Supplier Package | TSSOP |
| Standard Package Name | TSSOP |
| Maximum Operating Temperature | 95 |
| Package Length | 9.7 |
| Input Logic Compatibility | CMOS|LSTTL|3.3V(Min) |
| Minimum Operating Supply Voltage | 13 |
| Pin Count | 28 |
| Maximum Propagation Delay Time | 800 |
| Package Height | 1 |
| Number of Drivers | 6 |
| Maximum Operating Supply Voltage | 17.5 |
| Maximum Rise Time | 130 |
| Lead Shape | Gull-wing |
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