te connectivity / amp
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Type | Passive |
| Device Cooled | BGA |
| Attachment Method | Clip |
| Product Height | 19.53 mm |
| Fin Style | Radial |
| Finish | Black Anodized |
| Material | Aluminum |
| Standard Package | Bulk |
| RoHS | RoHS Compliant |
| Comment | Mounting clip does not increase overall heat sink height.; Heat sink assembly i |
| RoHSELV Compliance | RoHS compliant, ELV compliant |
| Lead Free Solder Processes | Not relevant for lead free process |
| Height (mm (in)) | 19.53 [0.769] |
| Diameter (mm in) | 48.26 [1.900] |
| Package Size (mm (in)) | 45 [1.773] |
| Device Type | BGA |
| Flammability Rating | UL 94V-0 |
| Heat Sink Type | 4 Fin Radial |
| For Use With | BGA Semiconductor Packages |
| Line | ChipCoolers |
| Product Type | Heat Sink |
| RoHSELV Compliance History | Converted to comply with RoHS directive |
| Series | * |
| Other Names | HTS18-P |
| rohs | Lead free / RoHS Compliant |
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