te connectivity / amp
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Type | Passive |
| Device Cooled | BGA |
| Attachment Method | Clip |
| Product Height | 27.94 mm |
| Fin Style | Pin Array |
| Finish | Black Anodized |
| Material | Cold-Forged Aluminum |
| Standard Package | Trays |
| RoHS | RoHS Compliant |
| Comment | Mounting clip does not increase overall heat sink height. |
| RoHSELV Compliance | RoHS compliant, ELV compliant |
| Lead Free Solder Processes | Not relevant for lead free process |
| Height (mm (in)) | 27.94 [1.100] |
| Diameter (mm in) | 50.80 [2.000] |
| Device Type | BGA |
| Flammability Rating | UL 94V-0 |
| Fan Type | No Fan |
| Heat Sink Type | Pin Fin 3 |
| For Use With | BGA Semiconductor Packages |
| Line | ChipCoolers |
| Product Type | Heat Sink |
| RoHSELV Compliance History | Always was RoHS compliant |
| Package Size (mm in) | 42.5 [1.675] |
| Series | * |
| Other Names | HTS268NF-U |
| rohs | Lead free / RoHS Compliant |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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