te connectivity / amp
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| 类型 | Backplane |
| 间距 | 2 mm |
| 行数 | 4 |
| 触点数 | 8Power |
| 端接方式 | Press Fit |
| 安装 | Through Hole |
| 触点电镀 | Gold Over Nickel |
| 标准包装 | Bulk |
| RoHSELV合规性 | ELV compliant, 5 of 6 Compliant |
| 发表类型 | Solder Post |
| Lead Free Solder Processes | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
| 触点材料 | Phosphor Bronze |
| PCB安装角度 | Vertical |
| 模块类型 | Power |
| 触点区域镀层材料 | Gold (30) over Nickel |
| 中心线矩阵（毫米） | 2.00 x 2.00 [.079 x .079] |
| 测序配置行答 | Mating Post Length 8mm, Termination Post Length 4.25mm |
| 外壳材料 | Liquid Crystal Polymer (LCP) |
| 测序配置行C | Mating Post Length 7.25mm, Termination Post Length 4.25mm |
| 电源位置数 | 8 |
| 测序配置D排 | Mating Post Length 6.5mm, Termination Post Length 4.25mm |
| 发表电镀 | Tin Lead over Nickel |
| 排序 | Yes |
| 产品类型 | Fixed-Board (Header) |
| 测序配置B行 | Mating Post Length 8mm, Termination Post Length 4.25mm |
| 额定电压（VAC ） | 30 |
| 终止（焊接）长度（mm （英寸） ） | 4.25 [0.167] |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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