所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| RoHSELV合规性 | RoHS/Not ELV Compliant |
| 触点材料 | Phosphor Bronze |
| Lead Free Solder Processes | Not relevant for lead free process |
| 每页行数接头 | 10 |
| 触点接合区长度(毫米) | 8.20 [0.323] |
| PCB安装角度 | Vertical |
| 模块类型 | Center |
| 卡间距(毫米( ) ) | 25.4 [1] |
| 联系方式 | Feed through, Press Fit |
| 外壳材料 | Polyester GF |
| 每连接器列 | 10 |
| 触点区域镀层材料 | Gold over Nickel |
| 端子尾部电镀 | Tin-Lead over Nickel |
| 触点类型 | Grounding |
| 信号触点数 | 100 |
| 产品类型 | Header Assembly |
| RoHSELV符合记录 | Always was RoHS not ELV compliant |
| 终止(焊接)长度(mm (英寸) ) | 13.00 [0.512] |
| 列数 | 10 |
| 连接器用途 | Backplane |
| 安装类型 | Through Hole |
| 标准包装 | 180 |
| 材料阻燃等级 | UL94 V-0 |
| 连接器类型 | Header, Male Pins and Blades |
| 触点表面涂层 | Gold |
| 封装 | Tube |
| 行数 | 10 |
| 加载位置的数目 | All |
| 间距 | 0.098" (2.50mm) |
| 端子 | Press-Fit |
| Contact Finish Thickness | 30µin (0.76µm) |
| 连接器类型 | Dual Beam, Center |
| 位置数 | 100 |
| RoHS指令 | Lead free / RoHS Compliant |
| RoHS | RoHS Compliant |
| 标准包装 | 20 |
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