te connectivity / amp
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| 类型 | High Speed Fine Pitch Connector |
| 间距 | 2.54/0.64 mm |
| 行数 | 2 |
| 触点数 | 114 |
| 性别 | PL |
| 触点电镀 | Gold Over Nickel |
| 端接方式 | Solder |
| 标准包装 | Rail / Tube |
| RoHSELV合规性 | RoHS compliant, ELV compliant |
| 接地母线材料 | Brass |
| Lead Free Solder Processes | Reflow solder capable to 245°C, Reflow solder capable to 260°C |
| 端子终端电镀 | Tin over Nickel |
| 触点材料 | Copper Alloy |
| 触点区域镀层材料 | Gold (30) over Nickel |
| 包装方式 | Tube |
| 接地总线引线类型 | Barbed |
| 间距（毫米） | 0.64 [0.025] |
| 外壳材料 | Liquid Crystal Polymer (LCP) |
| 安装角度 | Vertical |
| 接地总线引线长度（毫米（ ） ） | 1.52 [0.060] |
| 接地总线端接区域 | Tin over Nickel |
| 接地总线配合部位镀层 | Gold (30) |
| 插配堆叠高度（垂直） （毫米） | 12.57 [0.495], 21.60 [0.850] |
| 产品类型 | Connector |
| RoHSELV符合记录 | Always was RoHS compliant |
| 位置数 | 114 |
| 真空盖 | Without |
| 产品特点 | Board Guide, Ground Bus (Plane) |
| 安装类型 | Surface Mount |
| 连接器类型 | Plug, Outer Shroud Contacts |
| 触点表面涂层 | Gold |
| 封装 | Tube |
| 板上方高度 | 0.484" (12.29mm) |
| 啮合堆叠高度 | 12.57mm, 21.6mm |
| Contact Finish Thickness | 30µin (0.76µm) |
| RoHS指令 | Lead free / RoHS Compliant |
| 身体上的取向 | Straight |
| CAD绘图 | 3D CAD Model |
| 额定电流 | 1A |
| 额定电压 | 30 V ac |
| 工厂包装数量 | 10 |
| 产品种类 | Power to the Board |
| 系列 | MICTOR |
| 端接类型 | Solder |
| 位置/触点数 | 114 |
| RoHS | RoHS Compliant |
| 节距 | :0.64mm |
| No. of Contacts | :114 |
| Row Pitch | :7.06mm |
| No. of Rows | :2 |
| 接触端子 | :Surface Mount Vertical |
| Weight (kg) | 0 |
| Tariff No. | 85366930 |
| Brand/Series | MICTOR |
| NumberofContacts | 114 |
| PrimaryType | BoardtoBoard |
| 端子 | Solder |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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