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| Type | Description |
|---|---|
| 包装 | 3D2PAK |
| 通道模式 | Enhancement |
| 最大漏源电压 | 100 V |
| 最大连续漏极电流 | 33 A |
| RDS -于 | 44@10V mOhm |
| 最大门源电压 | ±20 V |
| 典型导通延迟时间 | 11 ns |
| 典型上升时间 | 35 ns |
| 典型关闭延迟时间 | 39 ns |
| 工作温度 | -55 to 175 °C |
| 安装 | Surface Mount |
| 标准包装 | Rail / Tube |
| 最大门源电压 | ±20 |
| 欧盟RoHS指令 | Compliant |
| 最高工作温度 | 175 |
| 标准包装名称 | D2PAK |
| 最低工作温度 | -55 |
| 渠道类型 | N |
| Maximum Drain Source Resistance | 44@10V |
| 最大漏源电压 | 100 |
| 每个芯片的元件数 | 1 |
| 供应商封装形式 | D2PAK |
| 最大功率耗散 | 130000 |
| 最大连续漏极电流 | 33 |
| 引脚数 | 3 |
| 铅形状 | Gull-wing |
| FET特点 | Standard |
| 封装 | Tube |
| 安装类型 | Surface Mount |
| 电流 - 连续漏极(Id ) @ 25 °C | 33A (Tc) |
| 的Vgs(th ) (最大)@ Id | 4V @ 250µA |
| 漏极至源极电压(Vdss) | 100V |
| 供应商设备封装 | D2PAK |
| 开态Rds(最大)@ Id ,V GS | 44 mOhm @ 16A, 10V |
| FET型 | MOSFET N-Channel, Metal Oxide |
| 功率 - 最大 | 130W |
| 封装/外壳 | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| 输入电容(Ciss ) @ VDS | 1960pF @ 25V |
| 其他名称 | *IRF540NSPBF |
| 闸电荷(Qg ) @ VGS | 71nC @ 10V |
| RoHS指令 | Lead free / RoHS Compliant |
| 类别 | Power MOSFET |
| 配置 | Single |
| 身高 | 4.83mm |
| 最大漏源电阻 | 0.044 Ω |
| 最高工作温度 | +175 °C |
| 最大功率耗散 | 130 W |
| 最低工作温度 | -55 °C |
| 包装类型 | D2PAK |
| 典型栅极电荷@ VGS | 71 nC V @ 10 |
| 典型输入电容@ VDS | 1960 pF V @ 25 |
| 工厂包装数量 | 50 |
| 晶体管极性 | N-Channel |
| 源极击穿电压 | 20 V |
| 连续漏极电流 | 33 A |
| 正向跨导 - 闵 | 21 S |
| 安装风格 | SMD/SMT |
| RDS(ON) | 44 mOhms |
| 功率耗散 | 3.8 W |
| 栅极电荷Qg | 47.3 nC |
| 上升时间 | 35 ns |
| 漏源击穿电压 | 100 V |
| RoHS | RoHS Compliant |
| 下降时间 | 35 ns |
| 漏极电流(最大值) | 33 A |
| 频率(最大) | Not Required MHz |
| 栅源电压(最大值) | �20 V |
| 输出功率(最大) | Not Required W |
| 噪声系数 | Not Required dB |
| 漏源导通电阻 | 0.044 ohm |
| 工作温度范围 | -55C to 175C |
| 极性 | N |
| 类型 | Power MOSFET |
| 元件数 | 1 |
| 工作温度分类 | Military |
| 漏极效率 | Not Required % |
| 漏源导通电压 | 100 V |
| 功率增益 | Not Required dB |
| 弧度硬化 | No |
| 删除 | Compliant |
| Continuous Drain Current Id | :33A |
| Drain Source Voltage Vds | :100V |
| On Resistance Rds(on) | :52mohm |
| Rds(on) Test Voltage Vgs | :10V |
| Threshold Voltage Vgs | :4V |
| 功耗 | :140W |
| Operating Temperature Min | :-55°C |
| Operating Temperature Max | :175°C |
| Transistor Case Style | :TO-263 |
| No. of Pins | :3 |
| MSL | :- |
| SVHC | :No SVHC (20-Jun-2013) |
| Alternate Case Style | :D2-PAK |
| Current Id Max | :33A |
| Current Temperature | :25°C |
| Full Power Rating Temperature | :25°C |
| Junction to Case Thermal Resistance A | :1.1°C/W |
| 工作温度范围 | :-55°C to +175°C |
| Power Dissipation on 1" Sq. PCB | :3.8W |
| Pulse Current Idm | :110A |
| SMD Marking | :IRF540NS |
| 端接类型 | :SMD |
| Voltage Vds | :100V |
| Voltage Vds Typ | :100V |
| Voltage Vgs Max | :4V |
| Voltage Vgs Rds on Measurement | :10V |
| Voltage Vgs th Max | :4V |
| Weight (kg) | 0.0018 |
| Tariff No. | 85412900 |
| Current,Drain | 33A |
| GateCharge,Total | 71nC |
| PackageType | D2Pak |
| 极化方式 | N-Channel |
| PowerDissipation | 130W |
| Resistance,DraintoSourceOn | 44Milliohms |
| Temperature,Operating,Maximum | +175°C |
| Temperature,Operating,Minimum | -55°C |
| Time,Turn-OffDelay | 39ns |
| Time,Turn-OnDelay | 11ns |
| Transconductance,Forward | 21S |
| Voltage,Breakdown,DraintoSource | 100V |
| Voltage,Forward,Diode | 1.2V |
| Voltage,GatetoSource | ±20V |
| 案例 | D2PAK |
| Gate charge | 47.3nC |
| Transistor kind | HEXFET |
| Transistor type | N-MOSFET |
| 功率 | 3.8W |
| Drain-source voltage | 100V |
| 极化 | unipolar |
| Drain current | 33A |
| Multiplicity | 1 |
| Gross weight | 5.56 g |
| gate-source voltage | 20V |
| On-state resistance | 44mΩ |
| Collective package [pcs] | 50 |
| Junction-to-case thermal resistance | 1.1K/W |
| spg | 50 |
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