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| Type | Description |
|---|---|
| 安装类型 | * |
| 标准包装 | 160 |
| 供应商设备封装 | * |
| 封装 | Tray |
| 电压 | 0.925 V ~ 1.5 V |
| 封装/外壳 | 432-TFBGA |
| 处理器类型 | ARM® Cortex™-A9, 32-Bit Single-Core |
| 速度 | 1.0GHz |
| 系列 | i.MX6SL |
| 单位重量 | 0.020738 oz |
| RoHS | RoHS Compliant |
| 安装 | Surface Mount |
| 包装类型 | MAP-BGA |
| 引脚数 | 432 |
| 筛选等级 | Commercial |
| 可编程 | Yes |
| 弧度硬化 | No |
| 工作电源电压(典型值) | 1.8/3.3 V |
| 处理单位 | Microprocessor |
| Graphics Acceleration | Yes |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Number of Cores/Bus Width | 1 Core, 32-Bit |
| 电压 - 输入/输出 | 1.2V, 1.8V, 3.0V |
| Additional Interfaces | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART |
| 工作温度 | 0°C ~ 95°C |
| Display & Interface Controllers | Keypad, LCD |
| 以太网 | 10/100 Mbps (1) |
| 核心处理器 | ARM Cortex-A9 |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (3) |
| RoHS指令 | Lead free / RoHS Compliant |
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