Texas Instruments
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Typical Single Supply Voltage | 12|15|18|24|28 |
| 安装 | Surface Mount |
| 的驱动器/接收器数 | 2 |
| Typical 3dB Bandwidth | 100 |
| Package Width | 3.1(Max) |
| PCB | 8 |
| 最大功率耗散 | 2140 |
| 类型 | Driver |
| 欧盟RoHS指令 | Compliant |
| 放大器拓扑 | Voltage Feedback Amplifier |
| 电源类型 | Single|Dual |
| 输出类型 | Differential |
| Minimum CMRR | 85 |
| 最低工作温度 | 0 |
| 供应商封装形式 | HVSSOP EP |
| 最高工作温度 | 70 |
| 最大单电源电压 | 33 |
| 最小双电源电压 | ±4.5 |
| Typical Dual Supply Voltage | ±5|±9|±12|±15 |
| 最大双电源电压 | ±16.5 |
| Package Length | 3.1(Max) |
| 引脚数 | 8 |
| 最小单电源电压 | 9 |
| 最大电源电流 | 0.0084@15V |
| Package Height | 0.95(Max) |
| 封装 | Tape and Reel |
| 典型的转换率 | 230 |
| 铅形状 | Gull-wing |
| 协议 | DSL |
| 安装类型 | Surface Mount |
| 标准包装 | 2,500 |
| 供应商设备封装 | 8-MSOP-PowerPad |
| 工作温度 | 0°C ~ 70°C |
| 电压 - 电源 | 5 V ~ 15 V |
| 封装/外壳 | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad |
| RoHS指令 | Lead free / RoHS Compliant |
| 包装类型 | HTSSOP EP |
| 压摆率 | 230 V/us |
| 电源要求 | Single/Dual |
| 弧度硬化 | No |
| Status | OBSOLETE |
| Temp (oC) | 0 to 70 |
| Package | Pins | MSOP-PowerPAD (DGN) | 8 |
| Device Marking | |
| Package QTY | Carrier | |
| New Flag | |
| Functional Diagram | |
| CMRR | |
| GBW | |
| Reference Design | |
| HiRel | |
| Package Group | MSOP-PowerPAD SOIC |
| BW @ Acl | 175 |
| Vs | 30 |
| 通道数 | 2 |
| Iib | 8000 |
| 附加功能 | |
| Rail-to-Rail | |
| 工作温度范围 | -40 to 85 0 to 70 |
| IIB | |
| Datasheet | SLOS290B |
| 建筑 | Voltage Feedback |
| Vn at Flatband | 10 |
| Iq per channel | |
| TI Design | |
| Vos (Offset Voltage @ 25C) | |
| Rating | Catalog |
| Offset Drift | |
| Vn at 1kHz | |
| Total Supply Voltage | |
| Acl, min spec gain | 1 |
| Settling Time (01%) | 43 |
| Offset Voltage Drift (+/-) | 15 |
| Io | 85 |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
|
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