texas instruments
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| Type | Description |
|---|---|
| 包装 | 14SOIC N |
| 传输速率 | 100 Mbps |
| 最大传播延迟时间 | 7 ns |
| 典型工作电源电压 | 3.3 V |
| 标准包装 | Rail / Tube |
| Package Width | 4(Max) |
| Maximum Differential Output Voltage | 0.45 |
| 安装 | Surface Mount |
| Differential Input Low Threshold Voltage | -0.1 |
| Differential Input High Threshold Voltage | 0.1 |
| PCB | 14 |
| 最大功率耗散 | 960 |
| 功能 | Driver/Receiver |
| 每个芯片的元件数 | 2 |
| 最低工作温度 | -40 |
| 传输速率 | 100 |
| 供应商封装形式 | SOIC |
| 典型工作电源电压 | 3.3|5 |
| 最高工作温度 | 85 |
| 接收器数 | 2 |
| 输入信号类型 | LVCMOS|LVTTL|LVDS |
| Package Length | 8.75(Max) |
| 引脚数 | 14 |
| 最大传播延迟时间 | 9 |
| Package Height | 1.5(Max) |
| 驱动器数 | 2 |
| 封装 | Rail |
| 标准包装名称 | SOIC |
| 铅形状 | Gull-wing |
| 协议 | LVDS |
| 安装类型 | * |
| 复式 | Full |
| 的驱动器/接收器数 | 1/1 |
| 供应商设备封装 | * |
| 工作温度 | -40°C ~ 85°C |
| 电压 - 电源 | 3 V ~ 5.5 V |
| 数据传输速率 | 100Mbps |
| 类型 | Transceiver |
| 封装/外壳 | 14-SOIC (0.154", 3.90mm Width) |
| RoHS指令 | Contains lead / RoHS non-compliant |
| 工厂包装数量 | 55 |
| 系列 | DS90LV019 |
| 安装风格 | SMD/SMT |
| 封装/外壳 | SOIC-14 Narrow |
| RoHS | No |
| 功率耗散 | 960 W |
| 差分输出电压 | 0.45 mV |
| 工作温度范围 | -40C to 85C |
| 输出类型 | Driver/Receiver |
| 包装类型 | SOIC N |
| 工作温度（最大） | 85C |
| 工作温度（最小值） | -40C |
| 传播延迟时间 | 7 ns |
| 元件数 | 2 |
| 输入类型 | LVCMOS/LVTTL/LVDS |
| 工作温度分类 | Industrial |
| 弧度硬化 | No |
| 工作电源电压（典型值） | 3.3 V |
| 差分输入高阈值电压 | 0.1 mV |
| 差异。 | -0.1 mV |
| IC Interface Type | :(Not Available) |
| Supply Voltage Min | :3V |
| Supply Voltage Max | :3.6V |
| Digital IC Case Style | :SOIC |
| No. of Pins | :14 |
| Operating Temperature Min | :-40°C |
| Operating Temperature Max | :85°C |
| MSL | :MSL 1 - Unlimited |
| SVHC | :No SVHC (20-Jun-2013) |
| Base Number | :90 |
| Line / Bus Driver / Receiver / Transceiver Type | :1 |
| No. of Drivers | :1 |
| No. of Receivers | :1 |
| 工作温度范围 | :-40°C to +85°C |
| 电源电流 | :15mA |
| Supply Voltage Range | :3V to 3.6V, 4.5V to 5.5V |
| 端接类型 | :SMD |
| 收发器类型 | :Differential |
| Voltage Vcc | :3.3V |
| Weight (kg) | 0.0001 |
| Tariff No. | 85423190 |
| Status | NRND |
| Replaced By | DS90LV019TM/NOPB |
| Temp (oC) | -40 to 85 |
| Package | Pins | SOIC (D) | 14 |
| Device Marking | View |
| Package QTY | Carrier | 55 | TUBE |
| TI Design | |
| Functional Diagram | fbd_snls008b.gif |
| Rating | Catalog |
| Output Signal | TTL LVTTL LVDS |
| No of Tx | 1 |
| Package Group | SOIC TSSOP |
| Datasheet | SNLS008B |
| ICC | 48 |
| ESD HBM | 2 |
| Reference Design | |
| Signaling Rate | 100 |
| 输入信号 | TTL LVTTL LVDS |
| HiRel | |
| No of Rx | 1 |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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