texas instruments
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| Type | Description |
|---|---|
| 包装 | 16CDIP |
| 驱动器数 | 8 |
| 传输速率 | 400 Mbps |
| 最大传播延迟时间 | 4.5 ns |
| 典型工作电源电压 | 3.3 V |
| 标准包装 | Rail / Tube |
| 典型工作电源电压 | 3.3 |
| 标准包装名称 | CDIP |
| 最大传播延迟时间 | 4.5 |
| Maximum Differential Output Voltage | 0.454 |
| Package Height | 3.56(Max) |
| 安装 | Through Hole |
| 传输速率 | 400 |
| 接收器数 | 4 |
| 封装 | Tube |
| PCB | 16 |
| 每个芯片的元件数 | 4 |
| Package Width | 7.62(Max) |
| 供应商封装形式 | CDIP |
| Package Length | 21.34(Max) |
| 最低工作温度 | -55 |
| 最高工作温度 | 125 |
| 引脚数 | 16 |
| 铅形状 | Through Hole |
| Status | ACTIVE |
| Temp (oC) | -55 to 125 |
| DSCC # | |
| Package | Pins | CDIP (J) | 16 |
| Device Marking | View |
| Package QTY | Carrier | 1 | TUBE |
| 功能 | Driver |
| TI Design | |
| Functional Diagram | |
| Rating | Military |
| Output Signal | LVDS |
| No of Tx | 4 |
| 工作温度范围 | -55 to 125 |
| Package Group | CDIP CFP LCCC |
| Datasheet | SLLS261M |
| ICC | 35 |
| ESD HBM | 8 |
| Reference Design | |
| Signaling Rate | 400 |
| 输入信号 | LVTTL |
| HiRel | Y |
| No of Rx |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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