Winbond Electronics Corporation- 存储设备

华邦电子股份有限公司成立于1987年9月，总部位于台湾台中市。公司于1995年在台湾证券交易所挂牌上市，现已成为台湾最大的自有品牌集成电路公司之一。华邦电子专注于半导体存储解决方案，核心产品包括利基型动态随机存取存储器（Specialty DRAM）、移动随机存取存储器（Mobile RAM）、NOR闪存和图形动态存取存储器（Graphics DRAM）。其主力产品线有SpiFlash系列串行NOR闪存、广泛应用于汽车与工业的利基型DDR/LPDDR DRAM，以及用于显示的GDDR显存等。公司还提供具有安全功能的闪存产品，满足物联网和嵌入式系统对数据安全的需求。凭借自主的设计与制程技术，华邦在台中拥有一座12英寸晶圆厂，能够灵活应对多样的市场需求。产品广泛应用于汽车电子、工业控制、消费类电子和通信设备等领域，并提供长期供应承诺和定制化存储方案。华邦全球员工约1800人，在中国大陆、香港、美国、日本及以色列等地设有分公司和办事处。在全球NOR闪存市场中，华邦位居主要供应商之列，以高可靠性和完整的产品组合著称。公司持续投入研发，致力以先进的半导体技术为客户提供特殊规格的内存解决方案，稳固其在存储领域的领先地位。

MODELS

存储设备 - 型号列表共 91 个型号

制造商零件编号	价格/库存	Package	Density	Operating Temperature	Address Bus Width	Maximum Random Access Time	Type	Operating Supply Voltage	Maximum Clock Rate	Pin Count	Interface Type	Typical Operating Supply Voltage	Packaging	Format - Memory	Supplier Device Package	Memory Type	Memory Size	Voltage - Supply	Standard Package	Interface	Speed	rohs	Address Bus Width	Typical Operating Supply Voltage	EU RoHS	Density	Minimum Operating Temperature	Supplier Package	Maximum Operating Temperature	Minimum Operating Supply Voltage	Maximum Operating Current	Maximum Random Access Time	Maximum Operating Supply Voltage	Architecture	Block Organization	Sector Size	Timing Type	Package / Case	Mounting	Package Width	Organization	PCB	Package Length	Package Height	Page Size	Standard Package Name	Number of Internal Banks	Maximum Clock Rate	Data Bus Width	Number of Words per Bank	Location Of Boot Block	Screening Level	Number of Words	Programming Voltage	Number of Bits per Word	Boot Block	Access Time (Max)	Address Bus	Operating Temp Range	Package Type	Operating Temperature Classification	Supply Current	Rad Hardened	Operating Supply Voltage (Typ)	Operating Supply Voltage (Min)	Operating Supply Voltage (Max)	Programming Voltage	Package/Case	存储容量	系列	供应商器件封装	存储器类型	操作温度	电压 - 电源	接口	封装/外壳	速度	格式 - 存储器	Lead Shape	Boot Type	Program/Erase Volt (Typ)	Word Size	Operating Temperature (Max)	Operating Temperature (Min)	Sync/Async	Programmable
W971GG6JB-25 DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin WBGA winbond electronics	询价	84WBGA	1 Gb	0 to 85 °C	-	0.4 ns	DDR2 SDRAM	1.8 V	800 MHz	84	-	-	-	-	-	-	-	-	-	-	-	-	16	1.8	Compliant	1G	0	WBGA	85	1.7	135	0.4	1.9	-	-	-	-	-	Surface Mount	8	64Mx16	84	12.5	0.8(Max)	-	-	8	800	16	8M	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W27C512P-45Z EEPROM Parallel 512K-bit 64K x 8 5V 32-Pin PLCC winbond electronics	询价	32PLCC	512 Kb	0 to 70 °C	-	45 ns	-	-	-	-	Parallel	5 V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	64Kx8	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	4.75 to 5.25\|11.75 to 12.25 V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W9825G6DH-6 DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II winbond electronics	询价	54TSOP-II	256 Mb	0 to 70 °C	15 Bit	6\|5 ns	SDRAM	3.3 V	166 MHz	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2 W25Q80BVSSIG Flash Serial-SPI 3.3V 8Mbit 1M x 8bit 8.5ns 8-Pin SOIC winbond electronics	询价	8SOIC	8 Mb	-40 to 85 °C	1 Bit	-	-	-	-	-	Serial-SPI	3.3 V	Tube	FLASH	8-SOIC	FLASH	8M (1M x 8)	2.7 V ~ 3.6 V	90	SPI Serial	104MHz	Lead free / RoHS Compliant	-	-	-	-	-	-	-	-	-	-	-	Sectored	Symmetrical	4Kbyte x 256	Asynchronous	-	-	-	-	-	-	-	256 byte	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	8-SOIC (0.209", 5.30mm Width)	8M (1M x 8)	SpiFlash®	8-SOIC	Flash	-40°C ~ 85°C	2.7 V ~ 3.6 V	SPI Serial	8-SOIC (0.209", 5.30mm Width)	104MHz	Flash	-	-	-	-	-	-	-	-
W9751G6IB-25 DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin WBGA winbond electronics	询价	84WBGA	512 Mb	0 to 85 °C	15 Bit	0.4 ns	DDR2 SDRAM	1.8 V	800 MHz	-	-	-	Tray	RAM	84-WBGA (8x12.5)	DDR2 SDRAM	512M (32M x 16)	1.7 V ~ 1.9 V	210	Parallel	2.5ns	Lead free / RoHS Compliant	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	84-TFBGA	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W25Q128BVFIG Flash Serial-SPI 3.3V 128Mbit 16M x 8bit 8.5ns 16-Pin SOIC winbond electronics	询价	16SOIC	128 Mb	-40 to 85 °C	24 Bit	-	-	-	-	16	Serial-SPI	3.3 V	-	-	-	-	-	-	-	-	-	-	24	3.3	Compliant	128M	-40	SOIC	85	2.7	18	8.5	3.6	Sectored	Symmetrical	4Kbyte x 4096	Synchronous	-	Surface Mount	7.49	-	16	10.31	2.31	256 byte	SOIC	-	-	-	-	Bottom\|Top	Industrial	16M	2.7 to 3.6	8	Yes	8.5 ns	24 b	-40C to 85C	SOIC	Industrial	18 mA	No	3.3 V	2.7 V	3.6 V	-	-	-	-	-	-	-	-	-	-	-	-	Gull-wing	Bottom/Top	2.7 to 3.6 V	8 b	85C	-40C	Synchronous	Yes
W25Q64BVSFIG Flash Serial-SPI 3.3V 64Mbit 64M x 1bit 7ns 16-Pin SOIC winbond electronics	询价	16SOIC	64 Mb	-40 to 85 °C	-	-	-	-	-	-	Serial-SPI	3.3 V	Tube	FLASH	16-SOIC	FLASH	64M (8M x 8)	2.7 V ~ 3.6 V	44	SPI Serial	80MHz	Lead free / RoHS Compliant	-	-	-	-	-	-	-	-	-	-	-	Sectored	Symmetrical	4Kbyte x 2048	Synchronous	16-SOIC (0.295", 7.50mm Width)	-	-	-	-	-	-	256 byte	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W9412G2IB-5 DRAM Chip DDR SDRAM 128M-Bit 4Mx32 2.5V 144-Pin LFBGA winbond electronics	询价	144LFBGA	128 Mb	0 to 70 °C	14 Bit	0.7 ns	DDR SDRAM	2.5 V	250 MHz	144	-	-	-	-	-	-	-	-	-	-	-	-	14	2.5	Compliant	128M	0	LFBGA	70	2.3	250	0.7	2.7	-	-	-	-	-	-	-	4Mx32	-	-	-	-	BGA	4	250	32	1M	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W9725G6JB-25 DRAM Chip DDR2 SDRAM 256M-Bit 16Mx16 1.8V 84-Pin WBGA winbond electronics	询价	84WBGA	256 Mb	0 to 85 °C	15 Bit	0.4 ns	DDR2 SDRAM	1.8 V	800 MHz	84	-	-	-	-	-	-	-	-	-	-	-	-	15	1.8	Compliant	256M	0	WBGA	85	1.7	110	0.4	1.9	-	-	-	-	-	Surface Mount	8	16Mx16	84	12.5	0.8(Max)	-	-	4	800	16	4M	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W9751G6JB-3 DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin WBGA winbond electronics	询价	84WBGA	512 Mb	0 to 85 °C	15 Bit	0.45 ns	DDR2 SDRAM	1.8 V	667 MHz	84	-	-	-	-	-	-	-	-	-	-	-	-	15	1.8	Compliant	512M	0	WBGA	85	1.7	150	0.45	1.9	-	-	-	-	-	Surface Mount	8	32Mx16	84	12.5	0.8(Max)	-	-	4	667	16	8M	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W9812G6JH-6 DRAM Chip SDRAM 128M-Bit 8Mx16 3.3V 54-Pin TSOP-II winbond electronics	询价	54TSOP-II	128 Mb	0 to 70 °C	14 Bit	6\|5 ns	SDRAM	3.3 V	166 MHz	54	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Surface Mount	-	8Mx16	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	6/5 ns	14 b	0C to 70C	TSOP-II	Commercial	75 mA	No	3.3 V	3 V	3.6 V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W9864G6JH-6 DRAM Chip SDRAM 64M-Bit 4Mx16 3.3V 54-Pin TSOP-II winbond electronics	询价	54TSOP-II	64 Mb	0 to 70 °C	14 Bit	6\|5 ns	SDRAM	3.3 V	166 MHz	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W25Q32BVZEIG Flash Serial-SPI 3V/3.3V 32Mbit 4M x 8bit 8.5ns 8-Pin WSON EP winbond electronics	询价	8WSON EP	32 Mb	-40 to 85 °C	1 Bit	-	-	-	-	-	Serial-SPI	3\|3.3 V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Sectored	Symmetrical	4Kbyte x 1024	Synchronous	-	-	-	-	-	-	-	256 byte	-	-	-	-	-	Bottom\|Top	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W25X20BVSNIG Flash Serial-SPI 3.3V 2Mbit 2M x 1bit 7ns 8-Pin SOIC winbond electronics	询价	8SOIC	2 Mb	-40 to 85 °C	24 Bit	-	-	-	-	-	Serial-SPI	3.3 V	Tube	FLASH	8-SOIC	FLASH	2M (256K x 8)	2.7 V ~ 3.6 V	100	SPI Serial	104MHz	Lead free / RoHS Compliant	-	-	-	-	-	-	-	-	-	-	-	Sectored	Symmetrical	4Kbyte x 64	Synchronous	8-SOIC (0.154", 3.90mm Width)	-	-	-	-	-	-	256 byte	-	-	-	-	-	Bottom\|Top	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W25X32VZEIG Flash Serial-SPI 3.3V 32Mbit 4M x 8bit 7ns 8-Pin WSON winbond electronics	询价	8WSON	32 Mb	-40 to 85 °C	24 Bit	-	-	-	-	8	Serial-SPI	3.3 V	Tube	FLASH	8-WSON (8x6)	FLASH	32M (4M x 8)	2.7 V ~ 3.6 V	100	SPI Serial	75MHz	Lead free / RoHS Compliant	24	3.3	Compliant	32M	-40	WSON	85	2.7	18	7	3.6	Sectored	Symmetrical	4Kbyte x 1024	Synchronous	8-WDFN Exposed Pad	Surface Mount	8	-	8	6	0.73	-	SON	-	-	-	-	-	Industrial	4M	2.7 to 3.6	8	No	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W25X40BVZPIG Flash Serial-SPI 3.3V 4Mbit 4M x 1bit 7ns 8-Pin WSON EP winbond electronics	询价	8WSON EP	4 Mb	-40 to 85 °C	24 Bit	-	-	-	-	8	Serial-SPI	3.3 V	Tube	FLASH	8-WSON (6x5)	FLASH	4M (512K x 8)	2.7 V ~ 3.6 V	100	SPI Serial	104MHz	Lead free / RoHS Compliant	24	3.3	Compliant	4M	-40	WSON EP	85	2.7	16.5	7	3.6	Sectored	Symmetrical	4Kbyte x 128	Synchronous	8-WDFN Exposed Pad	Surface Mount	6	-	8	5	0.73	256 byte	SON	-	-	-	-	Bottom\|Top	Industrial	4M	2.7 to 3.6	1	Yes	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W25X64VZEIG Flash Serial-SPI 3.3V 64Mbit 8M x 8bit 7ns 8-Pin WSON winbond electronics	询价	8WSON	64 Mb	-40 to 85 °C	23 Bit	-	-	-	-	8	Serial-SPI	3.3 V	Tube	FLASH	8-WSON (8x6)	FLASH	64M (8M x 8)	2.7 V ~ 3.6 V	63	SPI Serial	75MHz	Lead free / RoHS Compliant	23	3.3	Compliant	64M	-40	WSON	85	2.7	18	7	3.6	Sectored	Symmetrical	4Kbyte x 2048	Synchronous	8-WDFN Exposed Pad	-	-	-	-	-	-	-	SON	-	-	-	-	-	Industrial	8M	2.7 to 3.6	8	No	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W9412G2IB-4 DRAM Chip DDR SDRAM 128M-Bit 4Mx32 2.5V 144-Pin LFBGA winbond electronics	询价	144LFBGA	128 Mb	0 to 70 °C	14 Bit	0.6 ns	DDR SDRAM	2.5 V	250 MHz	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W9412G6JH-4 DRAM Chip DDR SDRAM 128M-Bit 8Mx16 2.5V 66-Pin TSOP winbond electronics	询价	66TSOP	128 Mb	0 to 70 °C	14 Bit	0.65 ns	DDR SDRAM	2.5 V	500 MHz	-	-	-	Tray	RAM	66-TSOP II	DDR SDRAM	128M (8M x 16)	2.4 V ~ 2.7 V	108	Parallel	250MHz	Lead free / RoHS Compliant	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	66-TSSOP (0.400", 10.16mm Width)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
W971GG6JB-18 DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin WBGA winbond electronics	询价	84WBGA	1 Gb	0 to 85 °C	-	0.35 ns	DDR2 SDRAM	1.8 V	1066 MHz	-	-	-	Tray	RAM	84-WBGA (8x12.5)	DDR2 SDRAM	1G (64M x 16)	1.7 V ~ 1.9 V	209	Parallel	1.875ns	Lead free / RoHS Compliant	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	84-TFBGA	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-

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Winbond Electronics Corporation- 存储设备

存储设备 - 型号列表共 91 个型号

Density

Package

Maximum Random Access Time

Memory Size

Density

Standard Package

Maximum Clock Rate

Organization

Maximum Operating Current

Sector Size

Supplier Device Package

Speed

Address Bus Width

Supplier Package

Pin Count

Maximum Random Access Time

Address Bus Width

Package / Case

Package Length

Type

Operating Supply Voltage

Operating Temperature

Package Width

PCB

Typical Operating Supply Voltage

Maximum Clock Rate

Minimum Operating Supply Voltage

Package Height

Number of Words per Bank

Maximum Operating Supply Voltage

Typical Operating Supply Voltage

Memory Type

Voltage - Supply

Number of Words

Standard Package Name

Number of Internal Banks

Minimum Operating Temperature

Maximum Operating Temperature

Data Bus Width

Interface Type

Timing Type

Packaging

Format - Memory

Interface

Number of Bits per Word

Boot Block

Access Time (Max)

Address Bus

Operating Temp Range

Package Type

Operating Temperature Classification

Supply Current

Operating Supply Voltage (Min)