Samsung Electronics Co., Ltd.- 氧化铌和硅电容器

三星电子有限公司成立于1969年，是三星集团的旗舰企业，总部位于韩国水原。该公司在消费电子、信息技术和半导体制造领域处于全球领先地位。在半导体方面，三星是全球最大的DRAM和NAND闪存芯片制造商，推动计算、移动和数据中心应用的创新。其系统LSI部门提供广泛的产品组合，包括Exynos系列移动处理器、ISOCELL图像传感器和电源管理芯片。三星半导体业务还提供先进的模拟和混合信号元件，如音频编解码器、无线充电芯片和显示驱动IC。公司的晶圆代工业务提供低至3纳米环绕栅极（GAA）节点的先进工艺技术，服务于全球主要无晶圆厂客户。此外，三星还生产用于汽车和工业应用的功率分立器件和LED元件。凭借在存储市场的绝对领先份额，三星按营收持续位列全球半导体公司前两名。其强大的专利组合和众多设计奖项证明了其技术领导力和对创新的承诺。该公司运营着全球研发中心和制造工厂网络，巩固了其作为电子供应链基石的地位。

MODELS

氧化铌和硅电容器 - 型号列表共 1,110 个型号

制造商零件编号	价格/库存	Package/Case	Mounting	Capacitance Value	Voltage	Tolerance	Dielectric	Operating Temperature	Construction	Product Length	Product Height	Standard Package	Packaging	Case Style	Mounting Type	Voltage - Rated	Capacitance	Temperature Coefficient	Size / Dimension	Applications	Package / Case	Thickness (Max)	rohs	Operating Temp Range	Rad Hardened	Failure Rate	Tolerance (+ or -)	Temp Coeff (Dielectric)	Wire Form	Mounting Style	Product Length (mm)	Product Depth (mm)	Product Height (mm)	Product Diameter (mm)	Product Length	EU RoHS	Maximum Operating Temperature	Product Depth	Product Height	Technology	Other Names	Style	Electrodes	T(A) min	Tape type	C(N)	T(A) max	Package	Case size	Automotive	Termination	V(N)	Matchcode	Unit Pack	Standard Leadtime	MOQ	Leadfree Defin.	Case	Multiplicity	Capacitor type	Gross weight	Capacitor kind	Operating voltage	Collective package [pcs]	spg	Operating temperature	Thickness(mm)	RatedVoltage	TempCharacteristic	Size L x W mm (Inch)	Standard Pack:	Height	Product Depth	Design / type	Type	Length	Diameter/width	Leadfree Defin	Ceramic type	Capacitance tolerance	Rated voltage	Construction form	Temperature range	电容	容差	大小/尺寸	电压 - 额定	操作温度	温度系数	应用	装配类型	系列	厚度（最大值）
4 CL10C681JB8NNNC Cap Ceramic 680pF 50V C0G 5% SMD 0603 125°C Paper T/R samsung electro-mechanics	询价	0603	Surface Mount	680 pF	50 Vdc	5 %	C0G	-55 to 125 °C	Flat	1.6 mm	0.8 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	50V	680pF	C0G, NP0	0.063" L x 0.031" W (1.60mm x 0.80mm)	General Purpose	0603 (1608 Metric)	0.035" (0.90mm)	Lead free / RoHS Compliant	-55C to 125C	No	Not Required	5%	C0G	Not Required	Surface Mount	1.6 mm	0.8 mm	0.8 mm	Not Required mm	1.6	Compliant	125	0.8	0.8	Standard	1276-1820-2	CHIP	BME	-55°C	PAPER	680pF	+125°C	0603	0603	NO	NISN	50V	KC680P0603NP0050J NORM	4000	20 weeks	4000	RoHS-conform	0603	100	ceramic	0.05 g	MLCC	50V	4000	4000	-55...125°C	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
4 CL32A106KAJNNNE Cap Ceramic 10uF 25V X5R 10% SMD 1210 85°C Embossed T/R samsung electro-mechanics	询价	1210	Surface Mount	10 uF	25 Vdc	10 %	X5R	-55 to 85 °C	Flat	3.2 mm	2.5 mm	Tape & Reel	Embossed Tape and Reel	Ceramic Chip	Surface Mount, MLCC	25V	10µF	X5R	0.126" L x 0.098" W (3.20mm x 2.50mm)	General Purpose	1210 (3225 Metric)	0.106" (2.70mm)	Lead free / RoHS Compliant	-55C to 85C	No	Not Required	10%	X5R	Not Required	Surface Mount	3.2 mm	2.5 mm	2.5 mm	Not Required mm	3.2	Compliant	85	2.5	2.5	Standard	1276-3360-2	CHIP	BME	-55°C	BLISTER	10µF	+85°C	1210	1210	NO	NISN	25V	KC10U1210X5R025K NORM	1000	20 weeks	1000	RoHS-conform	1210	100	ceramic	0.16 g	MLCC	25V	1000	1000	-55...85°C	-	-	-	-	-	2.5mm	-	COMMERCIAL	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
3 CL21F105ZOCNNNC Cap Ceramic 1uF 16VDC Y5V -20% to 80% SMD 0805 Paper T/R samsung electro-mechanics	询价	0805	Surface Mount	1 uF	16 Vdc	-20 to 80 %	Y5V	-30 to 85 °C	Flat	2 mm	0.85 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	16V	1.0µF	Y5V (F)	0.079" L x 0.049" W (2.01mm x 1.25mm)	General Purpose	0805 (2012 Metric)	0.037" (0.95mm)	Lead free / RoHS Compliant	-30C to 85C	No	Not Required	-20% to 80%	Y5V	Not Required	Surface Mount	2 mm	1.25 mm	0.85 mm	Not Required mm	2	Compliant	85	1.25	0.85	Standard	1276-1246-2	CHIP	BME	-30°C	PAPER	1µF	+85°C	0805	0805	NO	NISN	16V	KC1,0U0805Y5V016 Z NORM	4000	20 weeks	4000	RoHS-conform	0805	100	ceramic	0.05 g	MLCC	16V	4000	4000	-55...125°C	-	-	-	-	-	-	1.25 mm	-	Flat	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
4 CL31B225KBHNNNE Cap Ceramic 2.2uF 50VDC X7R 10% SMD 1206 Embossed T/R samsung electro-mechanics	询价	1206	Surface Mount	2.2 uF	50 Vdc	10 %	X7R	-55 to 125 °C	Flat	3.2 mm	1.6 mm	Tape & Reel	Embossed Tape and Reel	Ceramic Chip	Surface Mount, MLCC	50V	2.2µF	X7R	0.126" L x 0.063" W (3.20mm x 1.60mm)	General Purpose	1206	0.071" (1.80mm)	Lead free / RoHS Compliant	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	3.2 mm	1.6 mm	1.6 mm	Not Required mm	3.2	Compliant	125	1.6	1.6	Standard	1276-1291-2	CHIP	BME	-55°C	BLISTER	2,2µF	+125°C	1206	1206	NO	NISN	50V	KC2,2U1206X7R050K NORM	2000	20 weeks	2000	RoHS-conform	1206	10	ceramic	0.08 g	MLCC	50V	2000	2000	-	-	-	-	-	-	1.6mm	-	-	Flat	3.2mm	1.6mm	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2 CL05A105KO5NNNC Cap Ceramic 1uF 16V X5R 10% SMD 0402 85°C Paper T/R samsung electro-mechanics	询价	0402	Surface Mount	1 uF	16 Vdc	10 %	X5R	-55 to 85 °C	Flat	1 mm	0.5 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	16V	1.0µF	X5R	0.039" L x 0.020" W (1.00mm x 0.50mm)	General Purpose	0402	0.022" (0.55mm)	Lead free / RoHS Compliant	-55C to 85C	No	Not Required	10%	X5R	Not Required	Surface Mount	1 mm	0.5 mm	0.5 mm	Not Required mm	1	Compliant	85	0.5	0.5	Standard	1276-1067-2	CHIP	BME	-55°C	PAPER	1µF	+85°C	0402	0402	NO	NISN	16V	KC1,0U0402X5R016K NORM	10000	20 weeks	10000	RoHS-conform	-	-	-	-	-	-	-	-	-	-	-	-	-	10,000	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2 CL05B103KA5NNNC Cap Ceramic 0.01uF 25V X7R 10% SMD 0402 125°C Cardboard T/R samsung electro-mechanics	询价	0402	Surface Mount	0.01 uF	25 Vdc	10 %	X7R	-55 to 125 °C	Flat	1 mm	0.5 mm	Tape & Reel	Cardboard Tape and Reel	Ceramic Chip	Surface Mount, MLCC	25V	10000pF	X7R	0.039" L x 0.020" W (1.00mm x 0.50mm)	General Purpose	0402	0.022" (0.55mm)	Lead free / RoHS Compliant	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	1 mm	0.5 mm	0.5 mm	Not Required mm	1	Compliant	125	0.5	0.5	Standard	1276-1057-2	CHIP	BME	-55 °C	7"	10n F	+125 °C	0402	0402	NO	NISN	25 V	-	-	-	-	-	0402	100	ceramic	0.01 g	MLCC	25V	10000	10000	-55...125°C	0.5mm	25Vdc	X7R(-55 ~ +125)	1.0x0.5(0402)	-	0.5 mm	-	STANDARD	-	1 mm	0.5 mm	RoHS-conform	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
4 CL05C151JB5NNNC Cap Ceramic 150pF 50V C0G 5% SMD 0402 125°C Paper T/R samsung electro-mechanics	询价	0402	Surface Mount	150 pF	50 Vdc	5 %	C0G	-55 to 125 °C	Flat	1 mm	0.5 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	50V	150pF	C0G, NP0	0.039" L x 0.020" W (1.00mm x 0.50mm)	General Purpose	0402	0.022" (0.55mm)	Lead free / RoHS Compliant	-55C to 125C	No	Not Required	5%	C0G	Not Required	Surface Mount	1 mm	0.5 mm	0.5 mm	Not Required mm	1	Compliant	125	0.5	0.5	Standard	1276-1046-2	CHIP	BME	-55°C	PAPER	150pF	+125°C	0402	0402	NO	NISN	50V	KC150P0402NP0050J NORM	10000	20 weeks	10000	RoHS-conform	0402	100	ceramic	0.01 g	MLCC	50V	10000	10000	-55...125°C	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
4 CL10B103KB8NNNC Cap Ceramic 0.01uF 50V X7R 10% SMD 0603 125°C Paper T/R samsung electro-mechanics	询价	0603	Surface Mount	0.01 uF	50 Vdc	10 %	X7R	-55 to 125 °C	Flat	1.6 mm	0.8 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	50V	10000pF	X7R	0.063" L x 0.031" W (1.60mm x 0.80mm)	General Purpose	0603	0.035" (0.90mm)	Lead free / RoHS Compliant	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	1.6 mm	0.8 mm	0.8 mm	Not Required mm	1.6	Compliant	125	0.8	0.8	Standard	1276-1009-2	CHIP	BME	-55°C	PAPER	10nF	+125°C	0603	0603	NO	NISN	50V	KC10N0603X7R050K NORM	4000	20 weeks	4000	RoHS-conform	0603	100	ceramic	0.04 g	MLCC	50V	4000	4000	-55...125°C	-	-	-	-	4,000	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
5 CL10B332KB8NNNC Cap Ceramic 0.0033uF 50V X7R 10% SMD 0603 125°C Paper T/R samsung electro-mechanics	询价	0603	Surface Mount	0.0033 uF	50 Vdc	10 %	X7R	-55 to 125 °C	Flat	1.6 mm	0.8 mm	Tape & Reel	REEL PAP	Ceramic Chip	Surface Mount, MLCC	50V	3300pF	X7R	0.063" L x 0.031" W (1.60mm x 0.80mm)	General Purpose	0603	0.035" (0.90mm)	Lead free / RoHS Compliant	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	1.6 mm	0.8 mm	0.8 mm	Not Required mm	-	-	-	-	-	-	1276-1758-2	CHIP	BME	-55°C	PAPER	3,3nF	+125°C	0603	0603	NO	NISN	50V	KC3,3N0603X7R050K NORM	4000	20 weeks	4000	RoHS-conform	0603	100	ceramic	0.04 g	MLCC	50V	4000	4000	-55...125°C	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2 CL21A106KPFNNNE Cap Ceramic 10uF 10V X5R 10% SMD 0805 85°C Embossed T/R samsung electro-mechanics	询价	0805	Surface Mount	10 uF	10 Vdc	10 %	X5R	-55 to 85 °C	Flat	2 mm	1.25 mm	Tape & Reel	Embossed Tape and Reel	Ceramic Chip	Surface Mount, MLCC	10V	10µF	X5R	0.079" L x 0.049" W (2.01mm x 1.25mm)	General Purpose	0805	0.053" (1.35mm)	Lead free / RoHS Compliant	-55C to 85C	No	Not Required	10%	X5R	Not Required	Surface Mount	2 mm	1.25 mm	1.25 mm	Not Required mm	2	Compliant	85	1.25	1.25	Standard	1276-1052-2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0805	100	ceramic	0.04 g	MLCC	10V	2000	2000	-55...85°C	1.25mm	10Vdc	X5R(-55 ~ +85)	2.0x1.25(0805)	2,000	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2 CL21A475KPFNNNE Cap Ceramic 4.7uF 10V X5R 10% SMD 0805 85°C Embossed T/R samsung electro-mechanics	询价	0805	Surface Mount	4.7 uF	10 Vdc	10 %	X5R	-55 to 85 °C	Flat	2 mm	1.25 mm	Tape & Reel	Embossed Tape and Reel	Ceramic Chip	Surface Mount, MLCC	10V	4.7µF	X5R	0.079" L x 0.049" W (2.01mm x 1.25mm)	General Purpose	0805	0.053" (1.35mm)	Lead free / RoHS Compliant	-55C to 85C	No	Not Required	10%	X5R	Not Required	Surface Mount	2 mm	1.25 mm	1.25 mm	Not Required mm	2	Compliant	85	1.25	1.25	Standard	1276-1259-2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.25mm	10Vdc	X5R(-55 ~ +85)	2.0x1.25(0805)	-	-	-	-	-	-	-	-	X5R	±10%	10	0805	-55...+85 °C	-	-	-	-	-	-	-	-	-	-
2 CL21B102KBANNNC Cap Ceramic 0.001uF 50V X7R 10% SMD 0805 125°C Paper T/R samsung electro-mechanics	询价	0805	Surface Mount	0.001 uF	50 Vdc	10 %	X7R	-55 to 125 °C	Flat	2 mm	0.65 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	50V	1000pF	X7R	0.079" L x 0.049" W (2.01mm x 1.25mm)	General Purpose	0805	0.030" (0.75mm)	Lead free / RoHS Compliant	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	2 mm	1.25 mm	0.65 mm	Not Required mm	2	Compliant	125	1.25	0.65	Standard	1276-1020-2	CHIP	BME	-55°C	PAPER	1nF	+125°C	0805	0805	NO	NISN	50V	KC1,0N0805X7R050K NORM	4000	20 weeks	4000	RoHS-conform	0805	100	ceramic	0.04 g	MLCC	50V	40000	40000	-55...125°C	-	-	-	-	-	-	1.25 mm	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
3 CL21B333KBANNNC Cap Ceramic 0.033uF 50V X7R 10% SMD 0805 125°C Paper T/R samsung electro-mechanics	询价	0805	Surface Mount	0.033 uF	50 Vdc	10 %	X7R	-55 to 125 °C	Flat	2 mm	0.65 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	50V	0.033µF	X7R	0.079" L x 0.049" W (2.01mm x 1.25mm)	General Purpose	0805	0.030" (0.75mm)	Lead free / RoHS Compliant	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	2 mm	1.25 mm	0.65 mm	Not Required mm	2	Compliant	125	1.25	0.65	Standard	1276-1796-2	CHIP	BME	-55°C	PAPER	33nF	+125°C	0805	0805	NO	NISN	50V	KC33N0805X7R050K NORM	4000	20 weeks	4000	RoHS-conform	0805	100	ceramic	0.04 g	MLCC	50V	4000	4000	-55...125°C	-	-	-	-	-	-	1.25 mm	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
4 CL31B475KPHNNNE Cap Ceramic 4.7uF 10V X7R 10% SMD 1206 125°C Embossed T/R samsung electro-mechanics	询价	1206	Surface Mount	4.7 uF	10 Vdc	10 %	X7R	-55 to 125 °C	Flat	3.2 mm	1.6 mm	Tape & Reel	Embossed Tape and Reel	Ceramic Chip	Surface Mount, MLCC	10V	4.7µF	X7R	0.126" L x 0.063" W (3.20mm x 1.60mm)	General Purpose	1206 (3216 Metric)	0.071" (1.80mm)	Lead free / RoHS Compliant	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	3.2 mm	1.6 mm	1.6 mm	Not Required mm	3.2	Compliant	125	1.6	1.6	Standard	1276-1133-2	CHIP	BME	-55°C	BLISTER	4,7µF	+125°C	1206	1206	NO	NISN	10V	KC4,7U1206X7R010K NORM	2000	20 weeks	2000	RoHS-conform	1206	100	ceramic	0.07 g	MLCC	10V	2000	2000	-55...125°C	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
5 CL32A476MQJNNNE Cap Ceramic 47uF 6.3V X5R 20% SMD 1210 85°C Embossed T/R samsung electro-mechanics	询价	1210	Surface Mount	47 uF	6.3 Vdc	20 %	X5R	-55 to 85 °C	Flat	3.2 mm	2.5 mm	Tape & Reel	Embossed Tape and Reel	Ceramic Chip	Surface Mount, MLCC	6.3V	47µF	X5R	0.126" L x 0.098" W (3.20mm x 2.50mm)	General Purpose	1210	0.106" (2.70mm)	Lead free / RoHS Compliant	-55C to 85C	No	Not Required	20%	X5R	Not Required	Surface Mount	3.2 mm	2.5 mm	2.5 mm	Not Required mm	3.2	Compliant	85	2.5	2.5	Standard	1276-3381-2	CHIP	BME	-55°C	BLISTER	47µF	+85°C	1210	1210	NO	NISN	6.3V	KC47U1210X5R6,3M NORM	1000	20 weeks	1000	RoHS-conform	1210	10	ceramic	0.15 g	MLCC	6.3V	1000	1000	-55...85°C	-	-	-	-	1,000	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2 CL03A474MR3NNNC Cap Ceramic 0.47uF 4V X5R 20% SMD 0201 85°C Cardboard T/R samsung electro-mechanics	询价	0201	Surface Mount	0.47 uF	4 Vdc	20 %	X5R	-55 to 85 °C	Flat	0.6 mm	0.3 mm	Tape & Reel	Cardboard Tape and Reel	Ceramic Chip	Surface Mount, MLCC	4V	0.47µF	X5R	0.024" L x 0.012" W (0.60mm x 0.30mm)	General Purpose	0201	0.013" (0.33mm)	Lead free / RoHS Compliant	-55C to 85C	No	Not Required	20%	X5R	Not Required	Surface Mount	0.6 mm	0.3 mm	0.3 mm	Not Required mm	0.6	Compliant	85	0.3	0.3	Standard	1276-1339-2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.3mm	4Vdc	X5R(-55 ~ +85)	0.6x0.3(0201)	-	-	-	-	-	-	-	-	-	-	-	-	-	0.47µF	±20%	0.024" L x 0.012" W (0.60mm x 0.30mm)	4V	-55°C ~ 85°C	X5R	General Purpose	Surface Mount, MLCC	CL	0.013" (0.33mm)
CL03B102KO3NNND Cap Ceramic 0.001uF 16V X7R 10% SMD 0201 125°C Paper T/R samsung electro-mechanics	询价	0201	Surface Mount	0.001 uF	16 Vdc	10 %	X7R	-55 to 125 °C	Flat	0.6 mm	0.3 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	16V	1000pF	X7R	0.024" L x 0.012" W (0.60mm x 0.30mm)	General Purpose	0201 (0603 Metric)	0.013" (0.33mm)	Lead free / RoHS Compliant	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	0.6 mm	0.3 mm	0.3 mm	Not Required mm	0.6	Compliant	125	0.3	0.3	Standard	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.3mm	16Vdc	X7R(-55 ~ +125)	0.6x0.3(0201)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CL03B103KQ3NNNC Cap Ceramic 0.01uF 6.3V X7R 10% SMD 0201 125°C Paper T/R samsung electro-mechanics	询价	0201	Surface Mount	0.01 uF	6.3 Vdc	10 %	X7R	-55 to 125 °C	Flat	0.6 mm	0.3 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	6.3V	10000pF	X7R	0.024" L x 0.012" W (0.60mm x 0.30mm)	General Purpose	0201 (0603 Metric)	0.013" (0.33mm)	Lead free / RoHS Compliant	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	0.6 mm	0.3 mm	0.3 mm	Not Required mm	0.6	Compliant	125	0.3	0.3	Standard	1276-1344-2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.3mm	6.3Vdc	X7R(-55 ~ +125)	0.6x0.3(0201)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CL03B682KP3NNNC Cap Ceramic 0.0068uF 10V X7R 10% SMD 0201 125°C Paper T/R samsung electro-mechanics	询价	0201	Surface Mount	0.0068 uF	10 Vdc	10 %	X7R	-55 to 125 °C	Flat	0.6 mm	0.3 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	10V	6800pF	X7R	0.024" L x 0.012" W (0.60mm x 0.30mm)	General Purpose	0201 (0603 Metric)	0.013" (0.33mm)	Lead free / RoHS Compliant	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	0.6 mm	0.3 mm	0.3 mm	Not Required mm	0.6	Compliant	125	0.3	0.3	Standard	1276-1358-2	CHIP	BME	-55°C	PAPER	6,8nF	+125°C	0201	0201	NO	NISN	10V	KC6,8N0201X7R010K NORM	10000	20 weeks	10000	RoHS-conform	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CL03C0R8CA3GNNC Cap Ceramic 0.8pF 25V C0G 0.25pF SMD 0201 125°C Paper T/R samsung electro-mechanics	询价	0201	Surface Mount	0.8 pF	25 Vdc	0.25 pF	C0G	-55 to 125 °C	Flat	0.6 mm	0.3 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	25V	0.80pF	C0G, NP0	0.024" L x 0.012" W (0.60mm x 0.30mm)	General Purpose	0201 (0603 Metric)	0.013" (0.33mm)	Lead free / RoHS Compliant	-55C to 125C	No	Not Required	0.25pF	C0G	Not Required	Surface Mount	0.6 mm	0.3 mm	0.3 mm	Not Required mm	0.6	Compliant	125	0.3	0.3	Standard	1276-1381-2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.3mm	25Vdc	C0G(-55 ~ +125)	0.6x0.3(0201)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-

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Samsung Electronics Co., Ltd.- 氧化铌和硅电容器

氧化铌和硅电容器 - 型号列表共 1,110 个型号

Other Names

Capacitance Value

Capacitance

Matchcode

C(N)

Package / Case

Product Height

Product Height

Thickness (Max)

Product Height (mm)

Gross weight

Package/Case

Voltage

Product Depth

Package

Case size

V(N)

Voltage - Rated

Size / Dimension

Product Depth (mm)

Tolerance

Product Length

Product Length

Tolerance (+ or -)

Product Length (mm)

Case

Operating voltage

Collective package [pcs]

spg

RatedVoltage

Dielectric

Packaging

Unit Pack

MOQ

Temperature Coefficient

Temp Coeff (Dielectric)

Standard Pack:

Operating Temperature

T(A) min

Tape type

T(A) max

Operating Temp Range

Height

Thickness(mm)

TempCharacteristic

Size L x W mm (Inch)

Maximum Operating Temperature

Multiplicity

Operating temperature

Design / type

Length

Diameter/width