Samsung Electronics Co., Ltd.- CL 类陶瓷电容器

三星电子有限公司成立于1969年，是三星集团的旗舰企业，总部位于韩国水原。该公司在消费电子、信息技术和半导体制造领域处于全球领先地位。在半导体方面，三星是全球最大的DRAM和NAND闪存芯片制造商，推动计算、移动和数据中心应用的创新。其系统LSI部门提供广泛的产品组合，包括Exynos系列移动处理器、ISOCELL图像传感器和电源管理芯片。三星半导体业务还提供先进的模拟和混合信号元件，如音频编解码器、无线充电芯片和显示驱动IC。公司的晶圆代工业务提供低至3纳米环绕栅极（GAA）节点的先进工艺技术，服务于全球主要无晶圆厂客户。此外，三星还生产用于汽车和工业应用的功率分立器件和LED元件。凭借在存储市场的绝对领先份额，三星按营收持续位列全球半导体公司前两名。其强大的专利组合和众多设计奖项证明了其技术领导力和对创新的承诺。该公司运营着全球研发中心和制造工厂网络，巩固了其作为电子供应链基石的地位。

MODELS

CL 类陶瓷电容器 - 型号列表共 3,116 个型号

制造商零件编号	价格/库存	Package/Case	Mounting	Capacitance Value	Voltage	Tolerance	Dielectric	Operating Temperature	Construction	Product Length	Product Height	Standard Package	Packaging	Case Style	Mounting Type	Voltage - Rated	Capacitance	Temperature Coefficient	Size / Dimension	Applications	Thickness (Max)	rohs	Product Length	EU RoHS	Maximum Operating Temperature	Product Depth	Product Height	Technology	Other Names	Package / Case	Style	Electrodes	T(A) min	Tape type	C(N)	T(A) max	Package	Case size	Automotive	Termination	V(N)	Matchcode	Unit Pack	Standard Leadtime	MOQ	Leadfree Defin.	Operating Temp Range	Rad Hardened	Failure Rate	Tolerance (+ or -)	Temp Coeff (Dielectric)	Wire Form	Mounting Style	Product Length (mm)	Product Depth (mm)	Product Height (mm)	Product Diameter (mm)	Case	Multiplicity	Capacitor type	Gross weight	Capacitor kind	Operating voltage	Collective package [pcs]	spg	Operating temperature	Thickness(mm)	RatedVoltage	TempCharacteristic	Size L x W mm (Inch)	Type	Product Depth	Standard Pack:	Height	Design / type	Length	Diameter/width	Leadfree Defin	Ceramic type	Capacitance tolerance	Rated voltage	Construction form	Temperature range
CL21B473KBANNNC Cap Ceramic 0.047uF 50V X7R 10% SMD 0805 125°C Paper T/R samsung electro-mechanics	询价	0805	Surface Mount	0.047 uF	50 Vdc	10 %	X7R	-55 to 125 °C	Flat	2 mm	0.65 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	50V	0.047µF	X7R	0.079" L x 0.049" W (2.01mm x 1.25mm)	General Purpose	0.030" (0.75mm)	Lead free / RoHS Compliant	2	Compliant	125	1.25	0.65	Standard	1276-2527-2	0805 (2012 Metric)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.65mm	50Vdc	X7R(-55 ~ +125)	2.0x1.25(0805)	-	1.25 mm	-	-	-	-	-	-	-	-	-	-	-
4 CL10C681JB8NNNC Cap Ceramic 680pF 50V C0G 5% SMD 0603 125°C Paper T/R samsung electro-mechanics	询价	0603	Surface Mount	680 pF	50 Vdc	5 %	C0G	-55 to 125 °C	Flat	1.6 mm	0.8 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	50V	680pF	C0G, NP0	0.063" L x 0.031" W (1.60mm x 0.80mm)	General Purpose	0.035" (0.90mm)	Lead free / RoHS Compliant	1.6	Compliant	125	0.8	0.8	Standard	1276-1820-2	0603 (1608 Metric)	CHIP	BME	-55°C	PAPER	680pF	+125°C	0603	0603	NO	NISN	50V	KC680P0603NP0050J NORM	4000	20 weeks	4000	RoHS-conform	-55C to 125C	No	Not Required	5%	C0G	Not Required	Surface Mount	1.6 mm	0.8 mm	0.8 mm	Not Required mm	0603	100	ceramic	0.05 g	MLCC	50V	4000	4000	-55...125°C	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
6 CL31A106KAHNNNE Cap Ceramic 10uF 25V X5R 10% SMD 1206 85°C Embossed T/R samsung electro-mechanics	询价	1206	Surface Mount	10 uF	25 Vdc	10 %	X5R	-55 to 85 °C	Flat	3.2 mm	1.6 mm	Tape & Reel	Embossed Tape and Reel	Ceramic Chip	Surface Mount, MLCC	25V	10µF	X5R	0.126" L x 0.063" W (3.20mm x 1.60mm)	General Purpose	0.071" (1.80mm)	Lead free / RoHS Compliant	3.2	Compliant	85	1.6	1.6	Standard	1276-1075-2	-	CHIP	BME	-55°C	BLISTER	10µF	+85°C	1206	1206	NO	NISN	25V	KC10U1206X5R025K NORM	2000	20 weeks	2000	RoHS-conform	-	-	-	-	-	-	-	-	-	-	-	1206	100	ceramic	0.07 g	MLCC	25V	2000	2000	-55...85°C	-	-	-	-	-	-	2,000	-	-	-	-	-	-	-	-	-	-
4 CL32A106KAJNNNE Cap Ceramic 10uF 25V X5R 10% SMD 1210 85°C Embossed T/R samsung electro-mechanics	询价	1210	Surface Mount	10 uF	25 Vdc	10 %	X5R	-55 to 85 °C	Flat	3.2 mm	2.5 mm	Tape & Reel	Embossed Tape and Reel	Ceramic Chip	Surface Mount, MLCC	25V	10µF	X5R	0.126" L x 0.098" W (3.20mm x 2.50mm)	General Purpose	0.106" (2.70mm)	Lead free / RoHS Compliant	3.2	Compliant	85	2.5	2.5	Standard	1276-3360-2	1210 (3225 Metric)	CHIP	BME	-55°C	BLISTER	10µF	+85°C	1210	1210	NO	NISN	25V	KC10U1210X5R025K NORM	1000	20 weeks	1000	RoHS-conform	-55C to 85C	No	Not Required	10%	X5R	Not Required	Surface Mount	3.2 mm	2.5 mm	2.5 mm	Not Required mm	1210	100	ceramic	0.16 g	MLCC	25V	1000	1000	-55...85°C	-	-	-	-	-	-	-	2.5mm	COMMERCIAL	-	-	-	-	-	-	-	-
3 CL21F105ZOCNNNC Cap Ceramic 1uF 16VDC Y5V -20% to 80% SMD 0805 Paper T/R samsung electro-mechanics	询价	0805	Surface Mount	1 uF	16 Vdc	-20 to 80 %	Y5V	-30 to 85 °C	Flat	2 mm	0.85 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	16V	1.0µF	Y5V (F)	0.079" L x 0.049" W (2.01mm x 1.25mm)	General Purpose	0.037" (0.95mm)	Lead free / RoHS Compliant	2	Compliant	85	1.25	0.85	Standard	1276-1246-2	0805 (2012 Metric)	CHIP	BME	-30°C	PAPER	1µF	+85°C	0805	0805	NO	NISN	16V	KC1,0U0805Y5V016 Z NORM	4000	20 weeks	4000	RoHS-conform	-30C to 85C	No	Not Required	-20% to 80%	Y5V	Not Required	Surface Mount	2 mm	1.25 mm	0.85 mm	Not Required mm	0805	100	ceramic	0.05 g	MLCC	16V	4000	4000	-55...125°C	-	-	-	-	Flat	1.25 mm	-	-	-	-	-	-	-	-	-	-	-
CL10A105MQ8NNNC Cap Ceramic 1uF 6.3VDC X5R 20% SMD 0603 Paper T/R samsung electro-mechanics	询价	0603	Surface Mount	1 uF	6.3 Vdc	20 %	X5R	-55 to 85 °C	Flat	1.6 mm	0.8 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	6.3V	1.0µF	X5R	0.063" L x 0.031" W (1.60mm x 0.80mm)	General Purpose	0.035" (0.90mm)	Lead free / RoHS Compliant	1.6	Compliant	85	0.8	0.8	Standard	1276-1867-2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.8mm	6.3Vdc	X5R(-55 ~ +85)	1.6x0.8(0603)	Flat	-	-	-	-	-	-	-	-	-	-	-	-
2 CL31B103JBCNNNC Cap Ceramic 0.01uF 50VDC X7R 5% SMD 1206 Paper T/R samsung electro-mechanics	询价	1206	Surface Mount	0.01 uF	50 Vdc	5 %	X7R	-55 to 125 °C	Flat	3.2 mm	0.85 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	50V	10000pF	X7R	0.126" L x 0.063" W (3.20mm x 1.60mm)	General Purpose	0.037" (0.95mm)	Lead free / RoHS Compliant	3.2	Compliant	125	1.6	0.85	Standard	1276-2735-2	1206 (3216 Metric)	CHIP	BME	-55°C	PAPER	10nF	+125°C	1206	1206	NO	NISN	50V	KC10N1206X7R050J NORM	4000	20 weeks	4000	RoHS-conform	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Flat	1.6 mm	-	-	-	-	-	-	-	-	-	-	-
2 CL31B106KAHNNNE Cap Ceramic 10uF 25VDC X7R 10% SMD 1206 Embossed T/R samsung electro-mechanics	询价	1206	Surface Mount	10 uF	25 Vdc	10 %	X7R	-55 to 125 °C	Flat	3.2 mm	1.6 mm	Tape & Reel	Embossed Tape and Reel	Ceramic Chip	Surface Mount, MLCC	25V	10µF	X7R	0.126" L x 0.063" W (3.20mm x 1.60mm)	General Purpose	0.071" (1.80mm)	Lead free / RoHS Compliant	3.2	Compliant	125	1.6	1.6	Standard	1276-1804-2	-	CHIP	BME	-55°C	BLISTER	10µF	+125°C	1206	1206	NO	NISN	25V	KC10U1206X7R025K NORM	2000	20 weeks	2000	RoHS-conform	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Flat	-	-	-	-	-	-	-	-	-	-	-	-
4 CL31B225KBHNNNE Cap Ceramic 2.2uF 50VDC X7R 10% SMD 1206 Embossed T/R samsung electro-mechanics	询价	1206	Surface Mount	2.2 uF	50 Vdc	10 %	X7R	-55 to 125 °C	Flat	3.2 mm	1.6 mm	Tape & Reel	Embossed Tape and Reel	Ceramic Chip	Surface Mount, MLCC	50V	2.2µF	X7R	0.126" L x 0.063" W (3.20mm x 1.60mm)	General Purpose	0.071" (1.80mm)	Lead free / RoHS Compliant	3.2	Compliant	125	1.6	1.6	Standard	1276-1291-2	1206	CHIP	BME	-55°C	BLISTER	2,2µF	+125°C	1206	1206	NO	NISN	50V	KC2,2U1206X7R050K NORM	2000	20 weeks	2000	RoHS-conform	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	3.2 mm	1.6 mm	1.6 mm	Not Required mm	1206	10	ceramic	0.08 g	MLCC	50V	2000	2000	-	-	-	-	-	Flat	-	-	1.6mm	-	3.2mm	1.6mm	-	-	-	-	-	-
CL21F224ZAANNNC Cap Ceramic 0.22uF 25VDC Y5V -20% to 80% SMD 0805 Paper T/R samsung electro-mechanics	询价	0805	Surface Mount	0.22 uF	25 Vdc	-20 to 80 %	Y5V	-30 to 85 °C	Flat	2 mm	0.65 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	25V	0.22µF	Y5V (F)	0.079" L x 0.049" W (2.01mm x 1.25mm)	General Purpose	0.030" (0.75mm)	Lead free / RoHS Compliant	2	Compliant	85	1.25	0.65	Standard	1276-2710-2	0805 (2012 Metric)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.65mm	25Vdc	Y5V(-30 ~ +85)	2.0x1.25(0805)	Flat	1.25 mm	-	-	-	-	-	-	-	-	-	-	-
2 CL05A105KO5NNNC Cap Ceramic 1uF 16V X5R 10% SMD 0402 85°C Paper T/R samsung electro-mechanics	询价	0402	Surface Mount	1 uF	16 Vdc	10 %	X5R	-55 to 85 °C	Flat	1 mm	0.5 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	16V	1.0µF	X5R	0.039" L x 0.020" W (1.00mm x 0.50mm)	General Purpose	0.022" (0.55mm)	Lead free / RoHS Compliant	1	Compliant	85	0.5	0.5	Standard	1276-1067-2	0402	CHIP	BME	-55°C	PAPER	1µF	+85°C	0402	0402	NO	NISN	16V	KC1,0U0402X5R016K NORM	10000	20 weeks	10000	RoHS-conform	-55C to 85C	No	Not Required	10%	X5R	Not Required	Surface Mount	1 mm	0.5 mm	0.5 mm	Not Required mm	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	10,000	-	-	-	-	-	-	-	-	-	-
2 CL05B103KA5NNNC Cap Ceramic 0.01uF 25V X7R 10% SMD 0402 125°C Cardboard T/R samsung electro-mechanics	询价	0402	Surface Mount	0.01 uF	25 Vdc	10 %	X7R	-55 to 125 °C	Flat	1 mm	0.5 mm	Tape & Reel	Cardboard Tape and Reel	Ceramic Chip	Surface Mount, MLCC	25V	10000pF	X7R	0.039" L x 0.020" W (1.00mm x 0.50mm)	General Purpose	0.022" (0.55mm)	Lead free / RoHS Compliant	1	Compliant	125	0.5	0.5	Standard	1276-1057-2	0402	CHIP	BME	-55 °C	7"	10n F	+125 °C	0402	0402	NO	NISN	25 V	-	-	-	-	-	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	1 mm	0.5 mm	0.5 mm	Not Required mm	0402	100	ceramic	0.01 g	MLCC	25V	10000	10000	-55...125°C	0.5mm	25Vdc	X7R(-55 ~ +125)	1.0x0.5(0402)	-	-	-	0.5 mm	STANDARD	1 mm	0.5 mm	RoHS-conform	-	-	-	-	-
4 CL05C151JB5NNNC Cap Ceramic 150pF 50V C0G 5% SMD 0402 125°C Paper T/R samsung electro-mechanics	询价	0402	Surface Mount	150 pF	50 Vdc	5 %	C0G	-55 to 125 °C	Flat	1 mm	0.5 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	50V	150pF	C0G, NP0	0.039" L x 0.020" W (1.00mm x 0.50mm)	General Purpose	0.022" (0.55mm)	Lead free / RoHS Compliant	1	Compliant	125	0.5	0.5	Standard	1276-1046-2	0402	CHIP	BME	-55°C	PAPER	150pF	+125°C	0402	0402	NO	NISN	50V	KC150P0402NP0050J NORM	10000	20 weeks	10000	RoHS-conform	-55C to 125C	No	Not Required	5%	C0G	Not Required	Surface Mount	1 mm	0.5 mm	0.5 mm	Not Required mm	0402	100	ceramic	0.01 g	MLCC	50V	10000	10000	-55...125°C	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
4 CL10B103KB8NNNC Cap Ceramic 0.01uF 50V X7R 10% SMD 0603 125°C Paper T/R samsung electro-mechanics	询价	0603	Surface Mount	0.01 uF	50 Vdc	10 %	X7R	-55 to 125 °C	Flat	1.6 mm	0.8 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	50V	10000pF	X7R	0.063" L x 0.031" W (1.60mm x 0.80mm)	General Purpose	0.035" (0.90mm)	Lead free / RoHS Compliant	1.6	Compliant	125	0.8	0.8	Standard	1276-1009-2	0603	CHIP	BME	-55°C	PAPER	10nF	+125°C	0603	0603	NO	NISN	50V	KC10N0603X7R050K NORM	4000	20 weeks	4000	RoHS-conform	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	1.6 mm	0.8 mm	0.8 mm	Not Required mm	0603	100	ceramic	0.04 g	MLCC	50V	4000	4000	-55...125°C	-	-	-	-	-	-	4,000	-	-	-	-	-	-	-	-	-	-
2 CL10B104KO8NNNL Cap Ceramic 0.1uF 16V X7R 10% SMD 0603 125°C Paper T/R samsung electro-mechanics	询价	0603	Surface Mount	0.1 uF	16 Vdc	10 %	X7R	-55 to 125 °C	Flat	1.6 mm	0.8 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	16V	0.1µF	X7R	0.063" L x 0.031" W (1.60mm x 0.80mm)	General Purpose	0.035" (0.90mm)	Lead free / RoHS Compliant	1.6	Compliant	125	0.8	0.8	Standard	-	0603 (1608 Metric)	CHIP	BME	-55°C	PAPER	100nF	+125°C	0603	0603	NO	NISN	16V	KC100N0603X7R016K NORM	15000	20 weeks	15000	RoHS-conform	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
5 CL10B332KB8NNNC Cap Ceramic 0.0033uF 50V X7R 10% SMD 0603 125°C Paper T/R samsung electro-mechanics	询价	0603	Surface Mount	0.0033 uF	50 Vdc	10 %	X7R	-55 to 125 °C	Flat	1.6 mm	0.8 mm	Tape & Reel	REEL PAP	Ceramic Chip	Surface Mount, MLCC	50V	3300pF	X7R	0.063" L x 0.031" W (1.60mm x 0.80mm)	General Purpose	0.035" (0.90mm)	Lead free / RoHS Compliant	-	-	-	-	-	-	1276-1758-2	0603	CHIP	BME	-55°C	PAPER	3,3nF	+125°C	0603	0603	NO	NISN	50V	KC3,3N0603X7R050K NORM	4000	20 weeks	4000	RoHS-conform	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	1.6 mm	0.8 mm	0.8 mm	Not Required mm	0603	100	ceramic	0.04 g	MLCC	50V	4000	4000	-55...125°C	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
4 CL10C151JB8NNNC Cap Ceramic 150pF 50V C0G 5% SMD 0603 125°C Paper T/R samsung electro-mechanics	询价	0603	Surface Mount	150 pF	50 Vdc	5 %	C0G	-55 to 125 °C	Flat	1.6 mm	0.8 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	50V	150pF	C0G, NP0	0.063" L x 0.031" W (1.60mm x 0.80mm)	General Purpose	0.035" (0.90mm)	Lead free / RoHS Compliant	1.6	Compliant	125	0.8	0.8	Standard	1276-1280-2	-	CHIP	BME	-55°C	PAPER	150pF	+125°C	0603	0603	NO	NISN	50V	KC150P0603NP0050J NORM	4000	20 weeks	4000	RoHS-conform	-	-	-	-	-	-	-	-	-	-	-	0603	100	ceramic	0.04 g	MLCC	50V	4000	4000	-55...125°C	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2 CL21A106KPFNNNE Cap Ceramic 10uF 10V X5R 10% SMD 0805 85°C Embossed T/R samsung electro-mechanics	询价	0805	Surface Mount	10 uF	10 Vdc	10 %	X5R	-55 to 85 °C	Flat	2 mm	1.25 mm	Tape & Reel	Embossed Tape and Reel	Ceramic Chip	Surface Mount, MLCC	10V	10µF	X5R	0.079" L x 0.049" W (2.01mm x 1.25mm)	General Purpose	0.053" (1.35mm)	Lead free / RoHS Compliant	2	Compliant	85	1.25	1.25	Standard	1276-1052-2	0805	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-55C to 85C	No	Not Required	10%	X5R	Not Required	Surface Mount	2 mm	1.25 mm	1.25 mm	Not Required mm	0805	100	ceramic	0.04 g	MLCC	10V	2000	2000	-55...85°C	1.25mm	10Vdc	X5R(-55 ~ +85)	2.0x1.25(0805)	-	-	2,000	-	-	-	-	-	-	-	-	-	-
2 CL21A475KPFNNNE Cap Ceramic 4.7uF 10V X5R 10% SMD 0805 85°C Embossed T/R samsung electro-mechanics	询价	0805	Surface Mount	4.7 uF	10 Vdc	10 %	X5R	-55 to 85 °C	Flat	2 mm	1.25 mm	Tape & Reel	Embossed Tape and Reel	Ceramic Chip	Surface Mount, MLCC	10V	4.7µF	X5R	0.079" L x 0.049" W (2.01mm x 1.25mm)	General Purpose	0.053" (1.35mm)	Lead free / RoHS Compliant	2	Compliant	85	1.25	1.25	Standard	1276-1259-2	0805	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-55C to 85C	No	Not Required	10%	X5R	Not Required	Surface Mount	2 mm	1.25 mm	1.25 mm	Not Required mm	-	-	-	-	-	-	-	-	-	1.25mm	10Vdc	X5R(-55 ~ +85)	2.0x1.25(0805)	-	-	-	-	-	-	-	-	X5R	±10%	10	0805	-55...+85 °C
2 CL21B102KBANNNC Cap Ceramic 0.001uF 50V X7R 10% SMD 0805 125°C Paper T/R samsung electro-mechanics	询价	0805	Surface Mount	0.001 uF	50 Vdc	10 %	X7R	-55 to 125 °C	Flat	2 mm	0.65 mm	Tape & Reel	Paper Tape and Reel	Ceramic Chip	Surface Mount, MLCC	50V	1000pF	X7R	0.079" L x 0.049" W (2.01mm x 1.25mm)	General Purpose	0.030" (0.75mm)	Lead free / RoHS Compliant	2	Compliant	125	1.25	0.65	Standard	1276-1020-2	0805	CHIP	BME	-55°C	PAPER	1nF	+125°C	0805	0805	NO	NISN	50V	KC1,0N0805X7R050K NORM	4000	20 weeks	4000	RoHS-conform	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	2 mm	1.25 mm	0.65 mm	Not Required mm	0805	100	ceramic	0.04 g	MLCC	50V	40000	40000	-55...125°C	-	-	-	-	-	1.25 mm	-	-	-	-	-	-	-	-	-	-	-

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Samsung Electronics Co., Ltd.- CL 类陶瓷电容器

CL 类陶瓷电容器 - 型号列表共 3,116 个型号

Other Names

Matchcode

Capacitance Value

Capacitance

C(N)

Package / Case

Product Height

Product Height

Thickness (Max)

Product Height (mm)

Gross weight

Package/Case

Voltage

Product Depth

Voltage - Rated

Size / Dimension

Unit Pack

MOQ

Package

Case size

Product Depth (mm)

Case

Collective package [pcs]

spg

Tolerance

Dielectric

Product Length

Product Length

Packaging

Temperature Coefficient

Thickness(mm)

RatedVoltage

V(N)

Temp Coeff (Dielectric)

Product Length (mm)

Operating voltage

Operating Temperature

TempCharacteristic

Size L x W mm (Inch)

T(A) min

Tape type

T(A) max

Operating Temp Range

Tolerance (+ or -)

Standard Pack:

Height

Product Depth

Maximum Operating Temperature

Multiplicity

Operating temperature

Design / type

Length

Diameter/width