Samsung Electronics Co., Ltd.- 陶瓷介质电容器

三星电子有限公司成立于1969年，是三星集团的旗舰企业，总部位于韩国水原。该公司在消费电子、信息技术和半导体制造领域处于全球领先地位。在半导体方面，三星是全球最大的DRAM和NAND闪存芯片制造商，推动计算、移动和数据中心应用的创新。其系统LSI部门提供广泛的产品组合，包括Exynos系列移动处理器、ISOCELL图像传感器和电源管理芯片。三星半导体业务还提供先进的模拟和混合信号元件，如音频编解码器、无线充电芯片和显示驱动IC。公司的晶圆代工业务提供低至3纳米环绕栅极（GAA）节点的先进工艺技术，服务于全球主要无晶圆厂客户。此外，三星还生产用于汽车和工业应用的功率分立器件和LED元件。凭借在存储市场的绝对领先份额，三星按营收持续位列全球半导体公司前两名。其强大的专利组合和众多设计奖项证明了其技术领导力和对创新的承诺。该公司运营着全球研发中心和制造工厂网络，巩固了其作为电子供应链基石的地位。

MODELS

陶瓷介质电容器 - 型号列表共 4,438 个型号

制造商零件编号	价格/库存	Package/Case	Mounting	Capacitance Value	Voltage	Tolerance	Dielectric	Operating Temperature	Product Length	Product Height	Type	Standard Package	Construction	Product Length	EU RoHS	Maximum Operating Temperature	Product Depth	Product Height	Packaging	Case Style	Technology	Mounting Type	Voltage - Rated	Capacitance	Temperature Coefficient	Size / Dimension	Applications	Thickness (Max)	Other Names	rohs	Product Depth	Package / Case	Matchcode	Style	Electrodes	T(A) min	Tape type	Unit Pack	Standard Leadtime	MOQ	C(N)	T(A) max	Leadfree Defin.	Package	Case size	Automotive	Termination	V(N)	Case	Multiplicity	Capacitor type	Gross weight	Capacitor kind	Operating voltage	Collective package [pcs]	spg	Operating Temp Range	Rad Hardened	Failure Rate	Tolerance (+ or -)	Temp Coeff (Dielectric)	Wire Form	Mounting Style	Product Length (mm)	Product Depth (mm)	Product Height (mm)	Product Diameter (mm)	Operating temperature	Thickness(mm)	RatedVoltage	TempCharacteristic	Size L x W mm (Inch)	Height	Standard Pack:	Design / type	Length	Diameter/width
CL21B473KBANNNC Cap Ceramic 0.047uF 50V X7R 10% SMD 0805 125°C Paper T/R samsung electro-mechanics	询价	0805	Surface Mount	0.047 uF	50 Vdc	10 %	X7R	-55 to 125 °C	2 mm	0.65 mm	-	Tape & Reel	Flat	2	Compliant	125	1.25	0.65	Paper Tape and Reel	Ceramic Chip	Standard	Surface Mount, MLCC	50V	0.047µF	X7R	0.079" L x 0.049" W (2.01mm x 1.25mm)	General Purpose	0.030" (0.75mm)	1276-2527-2	Lead free / RoHS Compliant	1.25 mm	0805 (2012 Metric)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.65mm	50Vdc	X7R(-55 ~ +125)	2.0x1.25(0805)	-	-	-	-	-
4 CL10C681JB8NNNC Cap Ceramic 680pF 50V C0G 5% SMD 0603 125°C Paper T/R samsung electro-mechanics	询价	0603	Surface Mount	680 pF	50 Vdc	5 %	C0G	-55 to 125 °C	1.6 mm	0.8 mm	-	Tape & Reel	Flat	1.6	Compliant	125	0.8	0.8	Paper Tape and Reel	Ceramic Chip	Standard	Surface Mount, MLCC	50V	680pF	C0G, NP0	0.063" L x 0.031" W (1.60mm x 0.80mm)	General Purpose	0.035" (0.90mm)	1276-1820-2	Lead free / RoHS Compliant	-	0603 (1608 Metric)	KC680P0603NP0050J NORM	CHIP	BME	-55°C	PAPER	4000	20 weeks	4000	680pF	+125°C	RoHS-conform	0603	0603	NO	NISN	50V	0603	100	ceramic	0.05 g	MLCC	50V	4000	4000	-55C to 125C	No	Not Required	5%	C0G	Not Required	Surface Mount	1.6 mm	0.8 mm	0.8 mm	Not Required mm	-55...125°C	-	-	-	-	-	-	-	-	-
6 CL31A106KAHNNNE Cap Ceramic 10uF 25V X5R 10% SMD 1206 85°C Embossed T/R samsung electro-mechanics	询价	1206	Surface Mount	10 uF	25 Vdc	10 %	X5R	-55 to 85 °C	3.2 mm	1.6 mm	-	Tape & Reel	Flat	3.2	Compliant	85	1.6	1.6	Embossed Tape and Reel	Ceramic Chip	Standard	Surface Mount, MLCC	25V	10µF	X5R	0.126" L x 0.063" W (3.20mm x 1.60mm)	General Purpose	0.071" (1.80mm)	1276-1075-2	Lead free / RoHS Compliant	-	-	KC10U1206X5R025K NORM	CHIP	BME	-55°C	BLISTER	2000	20 weeks	2000	10µF	+85°C	RoHS-conform	1206	1206	NO	NISN	25V	1206	100	ceramic	0.07 g	MLCC	25V	2000	2000	-	-	-	-	-	-	-	-	-	-	-	-55...85°C	-	-	-	-	-	2,000	-	-	-
4 CL32A106KAJNNNE Cap Ceramic 10uF 25V X5R 10% SMD 1210 85°C Embossed T/R samsung electro-mechanics	询价	1210	Surface Mount	10 uF	25 Vdc	10 %	X5R	-55 to 85 °C	3.2 mm	2.5 mm	-	Tape & Reel	Flat	3.2	Compliant	85	2.5	2.5	Embossed Tape and Reel	Ceramic Chip	Standard	Surface Mount, MLCC	25V	10µF	X5R	0.126" L x 0.098" W (3.20mm x 2.50mm)	General Purpose	0.106" (2.70mm)	1276-3360-2	Lead free / RoHS Compliant	-	1210 (3225 Metric)	KC10U1210X5R025K NORM	CHIP	BME	-55°C	BLISTER	1000	20 weeks	1000	10µF	+85°C	RoHS-conform	1210	1210	NO	NISN	25V	1210	100	ceramic	0.16 g	MLCC	25V	1000	1000	-55C to 85C	No	Not Required	10%	X5R	Not Required	Surface Mount	3.2 mm	2.5 mm	2.5 mm	Not Required mm	-55...85°C	-	-	-	-	2.5mm	-	COMMERCIAL	-	-
3 CL21F105ZOCNNNC Cap Ceramic 1uF 16VDC Y5V -20% to 80% SMD 0805 Paper T/R samsung electro-mechanics	询价	0805	Surface Mount	1 uF	16 Vdc	-20 to 80 %	Y5V	-30 to 85 °C	2 mm	0.85 mm	Flat	Tape & Reel	Flat	2	Compliant	85	1.25	0.85	Paper Tape and Reel	Ceramic Chip	Standard	Surface Mount, MLCC	16V	1.0µF	Y5V (F)	0.079" L x 0.049" W (2.01mm x 1.25mm)	General Purpose	0.037" (0.95mm)	1276-1246-2	Lead free / RoHS Compliant	1.25 mm	0805 (2012 Metric)	KC1,0U0805Y5V016 Z NORM	CHIP	BME	-30°C	PAPER	4000	20 weeks	4000	1µF	+85°C	RoHS-conform	0805	0805	NO	NISN	16V	0805	100	ceramic	0.05 g	MLCC	16V	4000	4000	-30C to 85C	No	Not Required	-20% to 80%	Y5V	Not Required	Surface Mount	2 mm	1.25 mm	0.85 mm	Not Required mm	-55...125°C	-	-	-	-	-	-	-	-	-
CL10A105MQ8NNNC Cap Ceramic 1uF 6.3VDC X5R 20% SMD 0603 Paper T/R samsung electro-mechanics	询价	0603	Surface Mount	1 uF	6.3 Vdc	20 %	X5R	-55 to 85 °C	1.6 mm	0.8 mm	Flat	Tape & Reel	Flat	1.6	Compliant	85	0.8	0.8	Paper Tape and Reel	Ceramic Chip	Standard	Surface Mount, MLCC	6.3V	1.0µF	X5R	0.063" L x 0.031" W (1.60mm x 0.80mm)	General Purpose	0.035" (0.90mm)	1276-1867-2	Lead free / RoHS Compliant	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.8mm	6.3Vdc	X5R(-55 ~ +85)	1.6x0.8(0603)	-	-	-	-	-
2 CL31B103JBCNNNC Cap Ceramic 0.01uF 50VDC X7R 5% SMD 1206 Paper T/R samsung electro-mechanics	询价	1206	Surface Mount	0.01 uF	50 Vdc	5 %	X7R	-55 to 125 °C	3.2 mm	0.85 mm	Flat	Tape & Reel	Flat	3.2	Compliant	125	1.6	0.85	Paper Tape and Reel	Ceramic Chip	Standard	Surface Mount, MLCC	50V	10000pF	X7R	0.126" L x 0.063" W (3.20mm x 1.60mm)	General Purpose	0.037" (0.95mm)	1276-2735-2	Lead free / RoHS Compliant	1.6 mm	1206 (3216 Metric)	KC10N1206X7R050J NORM	CHIP	BME	-55°C	PAPER	4000	20 weeks	4000	10nF	+125°C	RoHS-conform	1206	1206	NO	NISN	50V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2 CL31B106KAHNNNE Cap Ceramic 10uF 25VDC X7R 10% SMD 1206 Embossed T/R samsung electro-mechanics	询价	1206	Surface Mount	10 uF	25 Vdc	10 %	X7R	-55 to 125 °C	3.2 mm	1.6 mm	Flat	Tape & Reel	Flat	3.2	Compliant	125	1.6	1.6	Embossed Tape and Reel	Ceramic Chip	Standard	Surface Mount, MLCC	25V	10µF	X7R	0.126" L x 0.063" W (3.20mm x 1.60mm)	General Purpose	0.071" (1.80mm)	1276-1804-2	Lead free / RoHS Compliant	-	-	KC10U1206X7R025K NORM	CHIP	BME	-55°C	BLISTER	2000	20 weeks	2000	10µF	+125°C	RoHS-conform	1206	1206	NO	NISN	25V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CL31B224KACNNND Cap Ceramic 0.22uF 25VDC X7R 10% SMD 1206 Paper T/R samsung electro-mechanics	询价	1206	Surface Mount	0.22 uF	25 Vdc	10 %	X7R	-55 to 125 °C	3.2 mm	0.85 mm	Flat	Tape & Reel	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.6 mm	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
4 CL31B225KBHNNNE Cap Ceramic 2.2uF 50VDC X7R 10% SMD 1206 Embossed T/R samsung electro-mechanics	询价	1206	Surface Mount	2.2 uF	50 Vdc	10 %	X7R	-55 to 125 °C	3.2 mm	1.6 mm	Flat	Tape & Reel	Flat	3.2	Compliant	125	1.6	1.6	Embossed Tape and Reel	Ceramic Chip	Standard	Surface Mount, MLCC	50V	2.2µF	X7R	0.126" L x 0.063" W (3.20mm x 1.60mm)	General Purpose	0.071" (1.80mm)	1276-1291-2	Lead free / RoHS Compliant	-	1206	KC2,2U1206X7R050K NORM	CHIP	BME	-55°C	BLISTER	2000	20 weeks	2000	2,2µF	+125°C	RoHS-conform	1206	1206	NO	NISN	50V	1206	10	ceramic	0.08 g	MLCC	50V	2000	2000	-55C to 125C	No	Not Required	10%	X7R	Not Required	Surface Mount	3.2 mm	1.6 mm	1.6 mm	Not Required mm	-	-	-	-	-	1.6mm	-	-	3.2mm	1.6mm
CL21F224ZAANNNC Cap Ceramic 0.22uF 25VDC Y5V -20% to 80% SMD 0805 Paper T/R samsung electro-mechanics	询价	0805	Surface Mount	0.22 uF	25 Vdc	-20 to 80 %	Y5V	-30 to 85 °C	2 mm	0.65 mm	Flat	Tape & Reel	Flat	2	Compliant	85	1.25	0.65	Paper Tape and Reel	Ceramic Chip	Standard	Surface Mount, MLCC	25V	0.22µF	Y5V (F)	0.079" L x 0.049" W (2.01mm x 1.25mm)	General Purpose	0.030" (0.75mm)	1276-2710-2	Lead free / RoHS Compliant	1.25 mm	0805 (2012 Metric)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.65mm	25Vdc	Y5V(-30 ~ +85)	2.0x1.25(0805)	-	-	-	-	-
SMSCL31B104KBCNNNC Cap Ceramic 0.1uF 50VDC X7R 10% SMD 1206 Paper T/R samsung electro-mechanics	询价	1206	Surface Mount	0.1 uF	50 Vdc	10 %	X7R	-55 to 125 °C	3.2 mm	0.85 mm	Flat	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.6 mm	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SMSCL10B104KA8NNNC Cap Ceramic 0.1uF 25VDC X7R 10% SMD 0603 Paper T/R samsung electro-mechanics	询价	0603	Surface Mount	0.1 uF	25 Vdc	10 %	X7R	-55 to 125 °C	1.6 mm	0.8 mm	Flat	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SMSCL10B223KB8NNNC Cap Ceramic 0.022uF 50VDC X7R 10% SMD 0603 Paper T/R samsung electro-mechanics	询价	0603	Surface Mount	0.022 uF	50 Vdc	10 %	X7R	-55 to 125 °C	1.6 mm	0.8 mm	Flat	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SMSCL10F104ZA8NNNC Cap Ceramic 0.1uF 25VDC Y5V -20% to 80% SMD 0603 Paper T/R samsung electro-mechanics	询价	0603	Surface Mount	0.1 uF	25 Vdc	-20 to 80 %	Y5V	-30 to 85 °C	1.6 mm	0.8 mm	Flat	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SMSCL21C100JBANNNC Cap Ceramic 10pF 50VDC C0G 5% SMD 0805 Paper T/R samsung electro-mechanics	询价	0805	Surface Mount	10 pF	50 Vdc	5 %	C0G	-55 to 125 °C	2 mm	0.65 mm	Flat	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.25 mm	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SMSCL31C102JBCNNNC Cap Ceramic 0.001uF 50VDC C0G 5% SMD 1206 Paper T/R samsung electro-mechanics	询价	1206	Surface Mount	0.001 uF	50 Vdc	5 %	C0G	-55 to 125 °C	3.2 mm	0.85 mm	Flat	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.6 mm	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SMSCL31C471JBCNNNC Cap Ceramic 470pF 50VDC C0G 5% SMD 1206 Paper T/R samsung electro-mechanics	询价	1206	Surface Mount	470 pF	50 Vdc	5 %	C0G	-55 to 125 °C	3.2 mm	0.85 mm	Flat	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.6 mm	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SMSCL32B225KBJNNNE Cap Ceramic 2.2uF 50V X7R 10% SMD 1210 125°C Embossed T/R samsung electro-mechanics	询价	1210	Surface Mount	2.2 uF	50 Vdc	10 %	X7R	-55 to 125 °C	3.2 mm	2.5 mm	-	-	Flat	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SMSCL10A474KA8NNNC Cap Ceramic 0.47uF 25VDC X5R 10% SMD 0603 Paper T/R samsung electro-mechanics	询价	0603	Surface Mount	0.47 uF	25 Vdc	10 %	X5R	-55 to 85 °C	1.6 mm	0.8 mm	Flat	Tape & Reel	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-

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Samsung Electronics Co., Ltd.- 陶瓷介质电容器

陶瓷介质电容器 - 型号列表共 4,438 个型号

Capacitance Value

Other Names

Capacitance

Matchcode

Product Height

Product Height

Package / Case

Thickness (Max)

C(N)

Package/Case

Voltage

Tolerance

Dielectric

Product Depth

Voltage - Rated

Temperature Coefficient

Size / Dimension

Package

Case size

Temp Coeff (Dielectric)

Product Depth (mm)

Product Height (mm)

Case

Gross weight

Operating Temperature

Product Length

Product Length

RatedVoltage

TempCharacteristic

Unit Pack

MOQ

V(N)

Operating Temp Range

Tolerance (+ or -)

Product Length (mm)

Operating voltage

Collective package [pcs]

spg

Product Depth

Maximum Operating Temperature

Packaging

Thickness(mm)

Size L x W mm (Inch)

T(A) min

Tape type

T(A) max

Multiplicity

Operating temperature

Height