Henkel AG & Co. KGaA- 喷嘴

汉高公司（全称Henkel AG & Co. KGaA）是一家德国跨国化工和消费品企业，创立于1876年，总部位于德国杜塞尔多夫。公司业务涵盖三大板块：粘合剂技术、美容护理、以及洗涤剂及家用护理。多核心（Multicore）品牌隶属于汉高粘合剂技术部门，专注于电子组装材料领域，尤其以焊接产品著称。多核心提供全面的焊接解决方案，包括焊锡丝、焊锡膏、助焊剂系统及液态助焊剂，深受全球组装专家信赖，适用于高可靠性场景。产品线覆盖无铅与含铅焊料合金、免清洗和水溶性助焊剂，以及针对下一代电子制造开发的先进化学配方。凭借超百年技术积淀，多核心持续创新，推出适应微型化、高温稳定性和严苛热循环要求的高性能焊料。汉高是全球粘合剂、密封剂及表面处理市场的领导者，在电子组装材料领域亦占有举足轻重的地位，与行业顶尖供应商并驾齐驱。依托强大的研发和工程团队，汉高电子材料服务于汽车、消费电子、通信和工业等全球市场。多核心品牌以其质量稳定性和卓越性能，成为印刷电路板组装和半导体封装的优选品牌。通过不断投入科研、可持续发展和工艺优化，汉高持续引领焊接与粘接解决方案的行业标准。

喷嘴 - 型号列表

共 15 个型号

制造商零件编号	库存	价格	标准包装数量	内核大小	直径	导线线规	类型	工艺（或'制程'，根据具体值如CMOS）	助焊剂类型	外形	成分	熔点	其他名称
389261 60/40 370 3% .015DIA./28SWG Multicore	247	1: ¥124.644	40	3%	0.015" (0.39mm)	26 AWG, 27 SWG	Wire Solder	Leaded	Rosin Activated (RA)	Spool, 227g (1/2 lb)	Sn60Pb40 (60/40)	-	-
386820 63/37 HYDRO-X 2% .022DIA/24SWG Multicore	77	1: ¥139.40	40	2%	0.022" (0.56mm)	23 AWG, 24 SWG	Wire Solder	Leaded	Water Soluble	Spool, 227g (1/2 lb)	Sn63Pb37 (63/37)	361°F (183°C)	82-134
397952 HMP 366 3% .022DIA./24SWG Multicore	130	1: ¥131.512	40	3%	0.022" (0.56mm)	23 AWG, 24 SWG	Wire Solder	Leaded	Rosin Activated (RA)	Spool, 227g (1/2 lb)	-	301 ~ 574°F (296 ~ 565°C)	-
386832 60/40 370 3% .064DIA./16SWG Multicore	87	1: ¥218.552	20	3%	0.064" (1.63mm)	14 AWG, 16 SWG	Wire Solder	Leaded	Rosin Activated (RA)	Spool, 454g (1 lb)	Sn60Pb40 (60/40)	-	-
386827 60/40 370 3% .032DIA./21SWG Multicore	170	1: ¥235.552	20	3%	0.032" (0.81mm)	20 AWG, 21 SWG	Wire Solder	Leaded	Rosin Activated (RA)	Spool, 454g (1 lb)	Sn60Pb40 (60/40)	-	-
386818 63/37 HYDRO-X 2% .032DIA/21SWG Multicore	74	1: ¥228.48	20	2%	0.032" (0.81mm)	20 AWG, 21 SWG	Wire Solder	Leaded	Water Soluble	Spool, 454g (1 lb)	Sn63Pb37 (63/37)	361°F (183°C)	82-132
386824 60/40 370 3% .024DIA./23SWG Multicore	82	1: ¥243.644	20	3%	0.024" (0.61mm)	22 AWG, 23 SWG	Wire Solder	Leaded	Rosin Activated (RA)	Spool, 454g (1 lb)	Sn60Pb40 (60/40)	-	-
395437 HMP 366 3% .028DIA./22SWG Multicore	72	1: ¥245.82	20	3%	0.028" (0.71mm)	21 AWG, 22 SWG	Wire Solder	Leaded	Rosin Activated (RA)	Spool, 454g (1 lb)	-	301 ~ 574°F (296 ~ 565°C)	-
386840 63/37 370, 3% .024DIA./23SWG Multicore	-		20	3%	0.024" (0.61mm)	22 AWG, 23 SWG	Wire Solder	Leaded	Rosin Activated (RA)	Spool, 454g (1 lb)	Sn63Pb37 (63/37)	-	-
MM01039 SN62 370 3% .032DIA./21SWG Multicore	-		20	3%	0.032" (0.81mm)	20 AWG, 21 SWG	Wire Solder	Leaded	Rosin Activated (RA)	Spool, 454g (1 lb)	Sn62Pb38 (62/38)	350°F (177°C)	-
397127 SN62 370 3% .024DIA/23SWG Multicore	10	1: ¥266.56	20	3%	0.024" (0.61mm)	22 AWG, 23 SWG	Wire Solder	Leaded	Rosin Activated (RA)	-	Sn62Pb38 (62/38)	350°F (177°C)	-
732977 97SC HYDRO-X 2% .064DIA/16SWG Multicore	35	1: ¥534.888	20	2%	0.064" (1.63mm)	14 AWG, 16 SWG	Wire Solder	Lead Free	Water Soluble	Spool, 454g (1 lb)	Sn96.5Ag3.0Cu0.5 (96.5/3/0.5)	423°F (217°C)	-
386839 63/37 370 3% .032DIA/21SWG Multicore	72	1: ¥228.684	20	3%	0.032" (0.81mm)	20 AWG, 21 SWG	Wire Solder	Leaded	Rosin Activated (RA)	Spool, 454g (1 lb)	Sn63Pb37 (63/37)	-	-
395439 HMP 366 3% .050DIA./18SWG Multicore	39	1: ¥207.332	20	3%	0.05" (1.27mm)	16 AWG, 18 SWG	Wire Solder	Leaded	Rosin Activated (RA)	Spool, 454g (1 lb)	-	301 ~ 574°F (296 ~ 565°C)	-
MM01075 63/37 HYDRO-X 2% .024DIA/23SWG Multicore	-		20	2%	0.024" (0.61mm)	22 AWG, 23 SWG	Wire Solder	Leaded	Water Soluble	Spool, 454g (1 lb)	Sn63Pb37 (63/37)	361°F (183°C)	-