Line Interface Unit 100-Pin TQFP EP | - | | Trays | -40 to 85 °C | 100TQFP EP |
M02016-1BP (WAFFLE PACKED DIE-UNTESTED) | - | | - | - | - |
Line Interface Unit 80-Pin TQFP EP | - | | Trays | -40 to 85 °C | 80TQFP EP |
622M, TRANSIMPEDANCE AMPLIFIER (TIA), WP | - | | - | - | - |
Line Interface Unit 100-Pin TQFP EP | - | | - | - | - |
| - | | Trays | 0 to 85 °C | - |
4XOC-3 ATM/POS PHY (OPTIPHY-F155) | - | | - | - | - |
2.5 GPBS TIA SAWN PROBED WAFER (SPBG) | - | | - | - | - |
10G LIMITING AMP CML OUTPUTS | - | | - | - | - |
2.5 GPBS TIA QUARTERED WAFER (QSPBG) | - | | - | - | - |
1.25 GPBS TIA QUARTERED WAFER (QSPBG) | - | | - | - | - |
M02129-13 TIA 8.5 GBPS WITH AGC | - | | - | - | - |
10 GBPS TIA WAFFLE PACKED DIE | - | | - | - | - |
1/10.3 GBPS BURST MODE TIA WITH RATE | - | | - | - | - |
1/10.3 GBPS BURST MODE TIA WITH RATE SEL | - | | - | - | - |
2.5 GPBS HIGH SEN TIA WAFFLE PACKED DIE | - | | - | - | - |
M02025-SAWN-PROBED-DIE-W-BG | - | | - | - | - |
1.25 GPBS TIA SAWN SILICON WAFER | - | | - | - | - |
M07820-W-PACK-DIE-TESTED/VIDEO TIA DIE | - | | - | - | - |
1/10.3 GBPS BURST MODE TIA WITH RATE | - | | - | - | - |