| 部件型号 |
厂商 |
描述 |
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Molex/Waldom |
3.00mm Pitch Micro-Fit 3.0⢠Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 2 Circuits, Tin (Sn) Plating |
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Molex/Waldom |
3.00mm Pitch Micro-Fit 3.0⢠Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 8 Circuits, Tin (Sn) Plating |
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Molex/Waldom |
3.00mm Pitch Micro-Fit 3.0⢠Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 22 Circuits, Tin (Sn) Plating |
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Molex/Waldom |
3.00mm Pitch Micro-Fit 3.0⢠Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits, 0.38µm Gold (Au) Selective Plating |
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Molex/Waldom |
Conn Power HDR 24 POS 4.2mm Solder ST Thru-Hole 24 Terminal 1 Port Tray |
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Molex/Waldom |
4.20mm Pitch Mini-Fit SMC⢠Surface Mount Compatible Header, Dual Row, Vertical, for 1.60mm PCB, 4 Circuits, Gold (Au) Plating, with Solderable Retention Clip |
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Molex/Waldom |
4.20mm Pitch Mini-Fit SMC⢠Surface Mount Compatible Header, Dual Row, Vertical, for 1.60mm PCB, 6 Circuits, Gold (Au) Plating, with Solderable Retention Clip |
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Molex/Waldom |
4.20mm Pitch Mini-Fit SMC⢠Surface Mount Compatible Header, Dual Row, Vertical, for 1.60mm PCB, 4 Circuits, Tin (Sn) Plating, with Solderable Retention Clip |
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|
Molex/Waldom |
4.20mm Pitch Mini-Fit SMC⢠Surface Mount Compatible Header, Dual Row, Vertical, for 1.60mm PCB, 6 Circuits, Tin (Sn) Plating, with Solderable Retention Clip |
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Molex/Waldom |
Conn Power HDR 10 POS 4.2mm Solder ST Thru-Hole 10 Terminal 1 Port Tray |
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Molex/Waldom |
4.20mm Pitch Mini-Fit BMI⢠Surface Mount Compatible Header, Dual Row, Vertical, 6 Circuits, 6.35mm PCB Thickness, with Snap-In Metal Pins, PA Polyamide Nylon 4/6, UL 94V-0, with Gold (Au) Over Nickel (Ni) Plating |
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Molex/Waldom |
Conn Power HDR 4 POS 4.2mm Solder RA Thru-Hole 4 Terminal 1 Port Bulk |
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Molex/Waldom |
4.20mm Pitch Mini-Fit Jr.⢠Header, Dual Row, Vertical, with 11.90mm Locking Ramp, 24 Circuits, with Both Snap-in Plastic Pegs |
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Molex/Waldom |
Conn Power HDR 8 POS 4.2mm Solder ST Thru-Hole 8 Terminal 1 Port Tray |
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Molex/Waldom |
Conn Wire to Board PL 6 POS 3mm Solder ST Thru-Hole Bag |
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Molex/Waldom |
3.00mm Pitch Micro-Fit 3.0⢠Test Plug, Dual Row, 12 Circuits |
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Molex/Waldom |
3.00mm Pitch Micro-Fit 3.0⢠Test Plug, Dual Row, 18 Circuits |
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Molex/Waldom |
Conn Wire to Board PL 22 POS 3mm Solder ST Thru-Hole Bag |
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Molex/Waldom |
None |
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Molex/Waldom |
3.00mm Pitch Micro-Fit 3.0 BMI⢠Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits, Tin (Sn) Plating |
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Molex/Waldom |
3.00mm Pitch Micro-Fit 3.0 BMI⢠Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits, 0.38µm Gold (Au) Selective Plating |
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Molex/Waldom |
3.00mm Pitch Micro-Fit 3.0 BMI⢠Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 20 Circuits, 0.76µm Gold (Au) Selective Plating |
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Molex/Waldom |
Conn Wire to Board HDR 24 POS 3mm Solder RA Thru-Hole Tray |
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Molex/Waldom |
3.00mm Pitch Micro-Fit 3.0 BMI⢠Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 14 Circuits, 0.38µm Gold (Au) Selective Plating |
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Molex/Waldom |
Conn Board to Board HDR 20 POS 3mm Solder ST Thru-Hole Tray |
