规格书 |
TSW Series Drawing xTSW (S,D,T) TH & RA Footprint HTSW, TSW Series Spec Sheet |
颜色 | Black |
Connector Type | Unshrouded |
Contact Finish Thickness | 10µin (0.25µm) |
Contact Finish | Gold |
Contact Mating Length | 0.230" (5.84mm) |
Molding Height Above Board | 0.100" (2.54mm) |
Mounting Type | Through Hole |
Number of Positions Loaded | All |
Number of Positions | 80 |
Number of Rows | 2 |
Pitch | 0.100" (2.54mm) |
Row Spacing | 0.100" (2.54mm) |
Termination | Solder |
类型 | Unshrouded Header |
间距 | 2.54 mm |
行数 | 2 |
触点数 | 80 |
性别 | HDR |
触点电镀 | Gold Over Nickel |
端接方式 | Solder |
标准包装 | Bulk |
触点接合长度 | 0.230" (5.84mm) |
安装类型 | Through Hole |
颜色 | Black |
连接器类型 | Header, Unshrouded |
触点表面涂层 | Gold |
封装 | Bulk |
位置数 | 80 |
触点类型 | Male Pin |
端子 | Solder |
Contact Finish Thickness | 10µin (0.25µm) |
行间距 | 0.100" (2.54mm) |
其他名称 | SAM1040-40 |
加载位置的数目 | All |
RoHS指令 | Lead free / RoHS Compliant |
系列 | :TSW |
节距 | :2.54mm |
No. of Rows | :2 |
No. of Contacts | :80 |
接触端子 | :Through Hole Vertical |
触点材料 | :Phosphor Bronze |
SVHC | :No SVHC (20-Jun-2013) |
Row Pitch | :2.54mm |
Weight (kg) | 0.01 |
Tariff No. | 85366930 |
mating | SLW-140-01-G-D SSW-140-01-G-D SSQ-140-02-S-D SSW-140-01-T-D BCS-140-L-D-HE CES-140-01-T-D More> |
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