规格书 |
TSW Series Drawing xTSW (S,D,T) TH & RA Footprint HTSW, TSW Series Spec Sheet |
颜色 | Black |
Connector Type | Unshrouded |
Contact Finish Thickness | 10µin (0.25µm) |
Contact Finish | Gold |
Contact Mating Length | 0.320" (8.13mm) |
Molding Height Above Board | 0.100" (2.54mm) |
Mounting Type | Through Hole |
Number of Positions Loaded | All |
Number of Positions | 64 |
Number of Rows | 2 |
Pitch | 0.100" (2.54mm) |
Row Spacing | 0.100" (2.54mm) |
Termination | Solder |
类型 | Unshrouded Header |
间距 | 2.54 mm |
行数 | 2 |
触点数 | 64 |
性别 | HDR |
触点电镀 | Gold Over Nickel |
端接方式 | Solder |
标准包装 | Bulk |
产品长度 | 81.28 |
欧盟RoHS指令 | Compliant |
产品厚度 | 5.08 |
身体上的取向 | Straight |
最大额定电压 | 550VAC |
产品高度 | 10.67 |
外壳材料 | Polyester |
间距 | 2.54 |
外壳颜色 | Black |
安装 | Through Hole |
最大额定电流 | 7.6/Contact |
触点材料 | Phosphor Bronze |
触点接合长度 | 0.320" (8.13mm) |
安装类型 | Through Hole |
颜色 | Black |
连接器类型 | Header, Unshrouded |
触点表面涂层 | Gold |
封装 | Bulk |
位置数 | 64 |
触点类型 | Male Pin |
端子 | Solder |
Contact Finish Thickness | 10µin (0.25µm) |
行间距 | 0.100" (2.54mm) |
其他名称 | SAM1052-32 |
加载位置的数目 | All |
RoHS指令 | Lead free / RoHS Compliant |
系列 | :TSW |
节距 | :2.54mm |
No. of Rows | :2 |
No. of Contacts | :64 |
接触端子 | :Through Hole Vertical |
SVHC | :No SVHC (20-Jun-2013) |
Row Pitch | :2.54mm |
Weight (kg) | 0.01 |
Tariff No. | 85366930 |
mating | ESQ-132-12-T-D SSQ-132-01-S-D SSQ-132-03-T-D SSM-132-S-DH BCS-132-L-D-PE SSM-132-L-DH More> |
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