图片仅供参考,产品以实物为准
| 规格书 |
 TSW Series Drawing xTSW (S,D,T) TH & RA Footprint HTSW, TSW Series Spec Sheet |
| 颜色 | Black |
| Connector Type | Unshrouded |
| Contact Finish Thickness | 10µin (0.25µm) |
| Contact Finish | Gold |
| Contact Mating Length | 0.230" (5.84mm) |
| Molding Height Above Board | 0.100" (2.54mm) |
| Mounting Type | Through Hole |
| Number of Positions Loaded | All |
| Number of Positions | 64 |
| Number of Rows | 2 |
| Pitch | 0.100" (2.54mm) |
| Row Spacing | 0.100" (2.54mm) |
| Termination | Solder |
| 类型 | Unshrouded Header |
| 间距 | 2.54 mm |
| 行数 | 2 |
| 触点数 | 64 |
| 性别 | HDR |
| 触点电镀 | Gold Over Nickel |
| 端接方式 | Solder |
| 标准包装 | Bulk |
| 触点接合长度 | 0.230" (5.84mm) |
| 安装类型 | Through Hole |
| 颜色 | Black |
| 连接器类型 | Header, Unshrouded |
| 触点表面涂层 | Gold |
| 封装 | Bulk |
| 位置数 | 64 |
| 触点类型 | Male Pin |
| 端子 | Solder |
| Contact Finish Thickness | 10µin (0.25µm) |
| 行间距 | 0.100" (2.54mm) |
| 其他名称 | SAM1036-32 |
| 加载位置的数目 | All |
| RoHS指令 | Lead free / RoHS Compliant |
| 系列 | :TSW |
| 节距 | :2.54mm |
| No. of Rows | :2 |
| No. of Contacts | :64 |
| 接触端子 | :Through Hole Vertical |
| 触点材料 | :Phosphor Bronze |
| SVHC | :No SVHC (20-Jun-2013) |
| Row Pitch | :2.54mm |
| Weight (kg) | 0.01 |
| Tariff No. | 85366930 |
| mating | ESQ-132-12-T-D SSQ-132-01-S-D SSQ-132-03-T-D SSM-132-S-DH BCS-132-L-D-PE SSM-132-L-DH More> |
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